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Dopant atoms are used to control the properties of semiconductors in most electronic devices. Recent advances such as single-ion implantation have allowed the precise positioning of single dopants in semiconductors as well as the fabrication of single-atom transistors, representing steps forward in the realization of quantum circuits. However, the interactions between dopant atoms have only been studied in systems containing large numbers of dopants, so it has not been possible to explore fundamental phenomena such as the Anderson-Mott transition between conduction by sequential tunnelling through isolated dopant atoms, and conduction through thermally activated impurity Hubbard bands. Here, we observe the Anderson-Mott transition at low temperatures in silicon transistors containing arrays of two, four or six arsenic dopant atoms that have been deterministically implanted along the channel of the device. The transition is induced by controlling the spacing between dopant atoms. Furthermore, at the critical density between tunnelling and band transport regimes, we are able to change the phase of the electron system from a frozen Wigner-like phase to a Fermi glass by increasing the temperature. Our results open up new approaches for the investigation of coherent transport, band engineering and strongly correlated systems in condensed-matter physics.

As the size of semiconductor devices continues to shrink, the normally random distribution of the individual dopant atoms within the semiconductor becomes a critical factor in determining device performance—homogeneity can no longer be assumed. Here we report the fabrication of semiconductor devices in which both the number and position of the dopant atoms are precisely controlled. To achieve this, we make use of a recently developed single-ion implantation technique, which enables us to implant dopant ions one-by-one into a fine semiconductor region until the desired number is reached. Electrical measurements of the resulting transistors reveal that device-to-device fluctuations in the threshold voltage (Vth; the turn-on voltage of the device) are less for those structures with ordered dopant arrays than for those with conventional random doping. We also find that the devices with ordered dopant arrays exhibit a shift in Vth, relative to the undoped semiconductor, that is twice that for a random dopant distribution (- 0.4 V versus -0.2 V); we attribute this to the uniformity of electrostatic potential in the conducting channel region due to the ordered distribution of dopant atoms. Our results therefore serve to highlight the improvements in device performance that can be achieved through atomic-scale control of the doping process. Furthermore, ordered dopant arrays of this type may enhance the prospects for realizing silicon-based solid-state quantum computers. [ABSTRACT FROM AUTHOR]

As semiconductor device dimensions decrease, the individual impurity atom position becomes a critical factor in determining device performance. We fabricated transistors with ordered and random dopant distributions on one side of the channel and evaluated the transconductance to investigate the impact of discrete dopant positions on the electron transport properties. The largest transconductance was observed when dopants were placed on the drain side in an ordered distribution; this was attributed to the suppression of injection velocity degradation on the source side and the uniformity of the electrostatic potential. Thus, the control of discrete dopant positions could enhance the device performance. [ABSTRACT FROM AUTHOR]