1. HYGROSCOPIC PROPERTIES OF THERMALLY POST-TREATED OSB.
- Author
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BONIGUT, Juergen and KRUG, Detlef
- Subjects
- *
SCOTS pine , *METHYLENE diphenyl diisocyanate , *MOISTURE in wood , *CREEP (Materials) ,THERMAL properties of wood - Abstract
OSB (oriented strandboards) made from Scots pine (Pinus sylvestris) were thermally post-treated at three different maximum treatment temperatures in the laboratory thermal treatment chamber of the Institute for Wood Technology Dresden (IHD). The OSB were supplied by a European manufacturer of OSB and bonded with methylene diphenyl diisocyanate (MDI). Post-treatment means that rather than thermally treating wood or strands before panel production, cut industry panels, i. e. 650mmx1200mm, were modified in IHD's lab kiln. The main goals of the thermal post-treatment of full-sized OSB were to improve the hygroscopic properties, i. e. to reduce the thickness swell (TS) and the equilibrium moisture content (EMC), as well as to improve the long-term properties creep behaviour and dimensional stability, without significantly reducing further mechanical properties like e. g. internal bond (IB) or bending properties, however. It was observed that the thermal post-treatment of the aforementioned OSB had a very positive effect on the moisture-related properties TS and EMC. The modified OSB showed far better values for said properties than the respective untreated ones. In can be concluded, that the thermal modification of OSB panels is possible and leads to very positive effects regarding their hygroscopic properties. [ABSTRACT FROM AUTHOR]
- Published
- 2013