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We analyze the effects of cross-diffusion on pattern formation in a PDE reaction-diffusion system introduced in Bozzini et al. 2013 to describe metal growth in an electrodeposition process. For this morphochemical model - which refers to the physico-chemical problem of coupling of growth morphology and surface chemistry - we have found that negative cross-diffusion in the morphological elements as well as positive cross-diffusion in the surface chemistry produce larger Turing parameter spaces and favor a tendency to stripeness that is not found in the case without cross-diffusion. The impact of cross-diffusion on pattern selection has been also discussed by the means of a stripeness index. Our theoretical findings are validated by an extensive gallery of numerical simulations that allow to better clarify the role of cross-diffusion both on Turing parameter spaces and on pattern selection. Experimental evidence of cross-diffusion in electrodeposition as well as a physico-chemical discussion of the expected impact of cross diffusion-controlled pattern formation in alloy electrodeposition processes complete the study. [ABSTRACT FROM AUTHOR]

In this paper, we investigate from a theoretical point of view the 2D reaction-diffusion system for electrodeposition coupling morphology and surface chemistry, presented and experimentally validated in Bozzini et al. (2013J. Solid State Electr.17, 467–479). We analyse the mechanisms responsible for spatio-temporal organization. As a first step, spatially uniform dynamics is discussed and the occurrence of a supercritical Hopf bifurcation for the local kinetics is proved. In the spatial case, initiation of morphological patterns induced by diffusion is shown to occur in a suitable region of the parameter space. The intriguing interplay between Hopf and Turing instability is also considered, by investigating the spatio-temporal behaviour of the system in the neighbourhood of the codimension-two Turing--Hopf bifurcation point. An ADI (Alternating Direction Implicit) scheme based on high-order finite differences in space is applied to obtain numerical approximations of Turing patterns at the steady state and for the simulation of the oscillating Turing–Hopf dynamics. [ABSTRACT FROM PUBLISHER]

In this paper we derive Hopf instability conditions for the morphochemical mathematical model for alloy electrodeposition introduced and experimentally validated in Bozzini et al. (J. Solid State Electrochem., 17:467-479, ). Using normal form theory we show that in the neighborhood of the Hopf bifurcation, essential features of the system dynamics are captured by a specific Complex Ginzburg-Landau Equation (CGLE). The derived CGLE yields analytical results on the existence and stability of spiral waves. Moreover, the arising of spiral instability is discussed in terms of the relevant system parameters and the related phenomenology is investigated numerically. To face with the numerical approximation of the spiral structures and of their longtime oscillating behavior we apply an Alternating Direction Implicit (ADI) method based on high order finite differences in space. [ABSTRACT FROM AUTHOR]

Abstract: In this paper we study the numerical approximation of Turing patterns corresponding to steady state solutions of a PDE system of reaction–diffusion equations modeling an electrodeposition process. We apply the Method of Lines (MOL) and describe the semi-discretization by high order finite differences in space given by the Extended Central Difference Formulas (ECDFs) that approximate Neumann boundary conditions (BCs) with the same accuracy. We introduce a test equation to describe the interplay between the diffusion and the reaction time scales. We present a stability analysis of a selection of time-integrators (IMEX 2-SBDF method, Crank–Nicolson (CN), Alternating Direction Implicit (ADI) method) for the test equation as well as for the Schnakenberg model, prototype of nonlinear reaction–diffusion systems with Turing patterns. Eventually, we apply the ADI-ECDF schemes to solve the electrodeposition model until the stationary patterns (spots & worms and only spots) are reached. We validate the model by comparison with experiments on Cu film growth by electrodeposition. [Copyright &y& Elsevier]