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The breakdown voltage (BVDS) of uniform doping (UD) and linear variable doping (LVD) silicon-on-insulator (SOI) p-channel laterally diffused metal oxide semiconductor field effect transistors (p-LDMOSFETs) is examined after exposure to the total ionizing dose (TID). The results show BVDS degradation with accumulated dose. TID degradation with the MOS device biased off is more severe than that with the MOS device biased on. Also, LVD BVDS is more significant than UD BVDS at a given TID. Technology computer-aided design (TCAD) simulation is used to gain an insight into the mechanism causing BVDS degradation. [ABSTRACT FROM AUTHOR]

The electrical characteristics of silicon-on-insulator (SOI) n-channel laterally diffused metal oxide semiconductor field effect transistors (NLDMOSFETs) are examined after exposure to the total ionizing dose (TID). The devices are partially radiation hardened in that the gate oxide (GOX) and the field oxide (FOX) have undergone a hardening process, but not the buried oxide (BOX). Two bias conditions, OFF-state and all terminals grounded, during irradiation are examined. The irradiated device shows that the OFF-state leakage current (IL) of these devices increases with the accumulated dose. The physical mechanisms for the IL are analyzed by technology computer-aided design (TCAD) simulation. The OFF-state leakage current (IL) can be explained due to the effects of radiation-induced trapped charge at the BOX silicon interface. [ABSTRACT FROM AUTHOR]

This paper presents the 2-D numerical simulation results of single-event burnout (SEB) in 4H-SiC junction barrier Schottky (JBS) diode by low carrier lifetime control (LCLC) for the first time. We investigate the SEB performance based on an 1800-V JBS structure and find that the most sensitive ion’s strike position is the middle of junction spacing because of the punchthrough of the electric field at anode contact. Then, the SEB hardening mechanism of LCLC is studied in this paper that the double-sided peak electric field can be effectively improved which results in a significantly decrease of maximal temperature. For the incident particle with different linear energy transfer values, we find that the SEB threshold voltage can be substantially enhanced when the carrier lifetime ($\tau $) is under a certain value. In addition, the basic characteristics with LCLC are discussed that the forward and reversed characteristics are hardly affected. [ABSTRACT FROM AUTHOR]

The characteristic degradations in silicon NPN bipolar junction transistors (BJTs) of type 3DD155 are examined under the irradiations of 25-MeV carbon (C), 40-MeV silicon (Si), and 40-MeV chlorine (Cl) ions respectively. Different electrical parameters are measured in-situ during the exposure of heavy ions. The experimental data shows that the changes in the reciprocal of the gain variation (Δ(1/β)) of 3DD155 transistors irradiated respectively by 25-MeV C, 40-MeV Si, and 40-MeV Cl ions each present a nonlinear behaviour at a low fluence and a linear response at a high fluence. The Δ(1/β) of 3DD155 BJT irradiated by 25-MeV C ions is greatest at a given fluence, a little smaller when the device is irradiated by 40-MeV Si ions, and smallest in the case of the 40-MeV Cl ions irradiation. The measured and calculated results clearly show that the range of heavy ions in the base region of BJT affects the level of radiation damage. [ABSTRACT FROM AUTHOR]

The characteristic degradations in a silicon NPN bipolar junction transistor (BJT) of 3DG142 type are examined under irradiation with 40-MeV chlorine (Cl) ions under forward, grounded, and reverse bias conditions, respectively. Different electrical parameters are in-situ measured during the exposure under each bias condition. From the experimental data, a larger variation of base current (IB) is observed after irradiation at a given value of base-emitter voltage (VBE), while the collector current is slightly affected by irradiation at a given VBE. The gain degradation is affected mostly by the behaviour of the base current. From the experimental data, the variation of current gain in the case of forward bias is much smaller than that in the other conditions. Moreover, for 3DG142 BJT, the current gain degradation in the case of reverse bias is more severe than that in the grounded case at low fluence, while at high fluence, the gain degradation in the reverse bias case becomes smaller than that in the grounded case. [ABSTRACT FROM AUTHOR]

An investigation of ionization and displacement damage in silicon NPN bipolar junction transistors (BJTs) is presented. The transistors were irradiated separately with 90-keV electrons, 3-MeV protons and 40-MeV Br ions. Key parameters were measured in-situ and the change in current gain of the NPN BJTS was obtained at a fixed collector current (Ic = 1 mA). To characterise the radiation damage of NPN BJTs, the ionizing dose Di and displacement dose Dd as functions of chip depth in the NPN BJTs were calculated using the SRIM and Geant4 code for protons, electrons and Br ions, respectively. Based on the discussion of the radiation damage equation for current gain, it is clear that the current gain degradation of the NPN BJTs is sensitive to both ionization and displacement damage. The degradation mechanism of the current gain is related to the ratio of Dd/(Dd +Di) in the sensitive region given by charged particles. The irraDiation particles leaDing to lower Dd/(Dd +Di) within the same chip depth at a given total dose would mainly produce ionization damage to the NPN BJTs. On the other hand, the charged particles causing larger Dd/(Dd + Di) at a given total dose would tend to generate Displacement damage to the NPN BJTs. The Messenger-Spratt equation could be used to describe the experimental data for the latter case. [ABSTRACT FROM AUTHOR]