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In this paper, we perform thermal and thermo-stress analyses on diode packaging with both currently used (traditional) and the newly designed (Zowie) structures in a 5W power adapter. To this end, a global-local methodology with ANSYS FEM software were employed with the equivalent material property equations, and temperature distribution measurements were simultaneously carried out for verification and extracting boundary conditions. The simulated mechanical behaviors on the two packaging designs are finally compared with discussions in this study.

To analyze thermal and thermo-stress behaviors of the diode packaging for high power applications, a global-local scheme through finite element simulations are performed in this study. To derive necessary boundary conditions and to verify the simulation results, thermal experiments are carried out for comparisons. New diode packaging designs are next proposed in this paper and their thermal resistance and structure stress are finally compared with the currently used ones to study the improvements.