1. Enhanced anti-oxidation performance of flake Cu-Ag powder by solvothermal treatment.
- Author
-
Shang, Rongrong, Gong, Xiaojuan, Teng, Jianwei, Liu, Bin, and Li, Yunping
- Subjects
- *
CONDUCTING polymer composites , *COPPER , *POWDERS , *SURFACE enhanced Raman effect , *ELECTRIC conductivity , *CATHODIC protection - Abstract
[Display omitted] • Solvothermal treatment on flake Cu-Ag powder was performed. • Anti-oxidation performance of powder was investigated. • The treatment significantly enhanced the oxidation resistance of powder. • This was ascribed to the reaction between Cu matrix and sodium formate solution. • A [Cu(μ.HCOO)(OH) 2 ] 2 layer was generated on the surface of powders during treatment. Cu-Ag flake powders demonstrate strong potential applying as the conductive phase in conductive polymer composite due to the good combination properties of electrical conductivity and anti-oxidation performance. In this study, the influence of solvothermal treatment in sodium formate on the surface microstructure and anti-oxidation performance of flake Cu-Ag powder was investigated systematically. The results indicated that solvothermal treatment at 200℃ for at least 16 h significantly enhanced the oxidation resistance of the aged Cu-5Ag flake powder in air, which was ascribed to the reaction between Cu matrix and sodium formate solution to create a [Cu(μ.HCOO)(OH) 2 ] 2 layer on the surface of powders and precipitated Ag along GBs during aging treatment. During the oxidation process, the [Cu(μ.HCOO)(OH) 2 ] 2 formed on the surface of flake powders provided cathodic protection to Cu atoms, and the precipitated Ag along GBs blocked the diffusion channels of Cu and O atoms, which resulted in exceptionally high anti-oxidation performance up to 283℃ of Cu-Ag flake powders. [ABSTRACT FROM AUTHOR]
- Published
- 2024
- Full Text
- View/download PDF