1. Thermal decomposition behavior of the HfO[sub 2]/SiO[sub 2]/Si system.
- Author
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Sayan, S., Garfunkel, E., Nishimura, T., Schulte, W. H., Gustafsson, T., and Wilk, G. D.
- Subjects
THIN films ,CHEMICAL vapor deposition ,IONS ,SCATTERING (Physics) ,X-rays ,PHOTOELECTRON spectroscopy ,SCANNING electron microscopy ,ATOMIC force microscopy - Abstract
We report on the thermal decomposition of uncapped, ultrathin HfO[SUB2] films grown by chemical vapor deposition on SiO[SUB2]/Si(100) substrates. Medium energy ion scattering, x-ray photoelectron spectroscopy, scanning electron microscopy and atomic force microscopy were used to examine the films after they had been annealed in vacuum to 900-1050°C. Film decomposition is a strong function of the HfO[SUB2] overlayer thickness at a given temperature, but the underlying SiO[SUB2] layer thickness does not significantly affect the thermal stability of the HfO[SUB2] film. Oxygen diffusion in the system was monitored by [SUP16]O/[SUP18]O isotopic labeling methods. Direct evidence of silicide formation is observed upon decomposition. [ABSTRACT FROM AUTHOR]
- Published
- 2003
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