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Novel continuous and mass customizable light-emitting diode (LED) lighting foil system, capable to produce adequate lighting levels for general lighting, was designed, processed, and characterized. Lighting element substrate was processed by roll-to-roll (R2R) printing using silver ink and automatic bonding of LEDs and current regulators on polyethylene terephthalate (PET) substrate using isotropic conductive adhesive (ICA). Demonstrator consisting of two basic lighting elements contained 98 LEDs and produced 860 lm when running with 25 mA operational current through the LEDs when using total electrical driving power of 8.4 W. Measured power conversion efficiency of the demonstrator was 31 % and efficacy 102 lm/W. Element produced 460 lx illumination level measured by an illumination level meter at element's central axis at distance of 1 m. At a distance of 2 m, illumination level was 110 lx, respectively. Temperature measurements with T3Ster thermal characterization instrument showed that when driving LED with maximum nominal driving current of 100 mA, LED junction temperature was about 120 °C, when lighting element was in air in room temperature. Accelerated environmental stress tests consisting of 500 cycles from -40 . +80 °C in aging oven and 1000 h in +60 °C/95 % RH climate chamber were performed to test samples without any failures. In addition, over 700 bending cycles using 20 mm bending radius were performed to test samples without any failures, so bonding of LEDs were shown reliable according to these tests. Achieved results proved that thin, flexible, and large area high luminous flux lighting elements and systems can be processed based on plastic foil manufactured using R2R silver ink printing and R2R automatic bonding of LEDs and regulator components using ICA on that foil.

A hermetic fiber pigtailed laser module utilizing passive device alignment on a low-temperature cofired ceramics (LTCC) substrate is demonstrated. The 3-D shape of the laminated and cofired ceramic substrate provides the necessary alignment structures, including grooves and cavities, for the laser-to-fiber coupling. When the laser diode chip and component tolerances are tight enough, the passive alignment allows high coupling efficiency realizations of multimode fiber pigtailed laser modules. The ceramic substrate is intrinsically hermetic and it opens up the possibility to use the substrate as an integrated part of the hermetic module package. In our concept hermetic sealing is produced by utilizing a Kovar frame, which is soldered to an LTCC substrate. The Kovar frame has a hole for a fiber feed-through and a hermetic glass-metal seal between fiber and frame is processed using a glass preform. The module can be used as a transmitter in a laser pulse time-of-flight distance sensor and in this application it can be overdriven by a factor of 10. This means that the peak optical power in the pulses can be several dozen watts. The laser chip allows this kind of overdriving, due to the fact that the duty factor in the operation is only 0.0% at 2 kHz pulsing frequency, which leads to an average power of several milliwatts. The simulated nominal coupling efficiency between the 210 mum times 1 mum stripe laser and the 200/220 mum step index fiber (NA = 0.22) was 0.65. The measured coupling efficiency of the hermetically sealed prototypes varied from 0.14 to 0.64, where the average was 0.39. A leak rate of 1 times 10-7 . .. 8 times 10-7 [atm times cm3/s] was measured in the helium leak tests of the final operational prototypes, when the modules were tested according to MIL-STD-883F method 1014.9 specification. The rather high leak rate is mainly due to the helium absorbed by the fiber polymer buffer layer and rubber guard tube in the pressurization process. The leak rate for the dummy modules using a buffer stripped fiber without a rubber guard tube was 3 times 10-9 . .. 1 times 10-8 [atm times cm3/s]. The maximum allowed leak rate for this size of hermetic module is 1 times 10-7 [atm times cm3/s]. The background helium level before and after the tests was less than 3 times 10-10 [atm times cm3/s]. Measurements proved that the manufacturing procedure is capable of producing hermetic fiber pigtailed laser modules.

An infrared (IR) temperature measurement system consists of a sensor module and electronics as well as an optomechanical system that guides IR radiation onto the sensor. The geometry and emissivity of the optomechanics can affect the temperature reading. We show how the traditional optomechanical design of the IR temperature measuring systems produce inaccurate results when used in handheld mobile devices. When the mobile device is not thermally stable and the measured targets are significantly colder than the device, the measurement error can be several degrees. Our new optomechanical design was optimised for handheld mobile use, and its optics performance was modelled and verified by prototyping. The temperature measurement and sensor calibration is based on only two signals, namely the thermopile and thermistor voltages of the IR detector. This is a very attractive method in high-volume consumer products because no additional components are needed to improve the measurement repeatability. The attainable repeatability of the implemented IR temperature sensor on a correct transferred calibration curve was better than ±0.5 °C in an operational temperature range from +13 to +49 °C and target range from +10 to +90 °C.

An infrared (IR) temperature measurement system consists of not only a sensor module and electronics, but also an optomechanical system that guides IR radiation onto the sensor. The geometry and emissivity of the parts affects the reading, if the detector sees not only the target but parts of the measuring system itself. In normal industrial applications, the optics is designed so that the surfaces stabilize to the same temperature as the sensor. This allows the error caused by the device temperature to be easily calibrated away. The correction is valid for stationary conditions and usually near the calibration temperature, which is typically at room temperature. However, we show that if the sensor is embedded into a mobile (hand-held) device which has heat sources, such as power electronics, the normal conditions are no longer valid and the calibration fails. In order to improve infrared temperature sensing for mobile devices, the optics concept was studied and detailed design was performed. In addition, the optics performance was modelled and verified by measurement sensor prototyping. A calibration procedure noticing operational temperature variations was applied. The repeatability of the implemented IR temperature sensor using on a correct transferred calibration curve was better than plusmn0.5degC in an operational temperature range from +12.6 to +49.3degC and target range from +10 to +90degC.

A hermetic fibre pigtailed laser module utilizing passive device alignment on a low temperature co-fired ceramics (LTCC) substrate is demonstrated. The 3-dimensional shape of the laminated and fired ceramic substrate provides the necessary alignment structures including holes, grooves and cavities for the laser to fibre coupling. The achieved passive alignment accuracy allows high coupling efficiency realizations of multi-mode fibre pigtailed laser modules. The ceramic substrate is intrinsically hermetic and it opens up a possibility to produce cost efficient hermetic packaging. In our concept hermetic sealing is produced by utilizing Kovar frame, which is soldered to an LTCC substrate. Kovar frame has a hole for fibre feed-trough and a hermetic glass-metal sealing between fibre and frame is processed using glass preform. The heart of the module is a power laser diode chip, which can produce several watts of continuous power. The module, however, can be finally used as a transmitter in a laser pulse time-of-flight distance sensor and in this application it can be overdriven by a factor of 10. This means that the peak optical power in the pulses can be several tens of watts. The laser chip allows this kind of overdriving due to the fact that the duty factor in the operation is only 0.0001 at 2 kHz pulsing frequency. Optical coupling efficiency of the multi-mode laser system was simulated using optical systems simulation software. The nominal coupling efficiency between 210 μm x 1μm stripe laser and 200/220 μm step index fibre (NA=0.22) was 0.65. The simulated coupling efficiency was verified by prototype realization and characterization. The measured average coupling efficiency of the hermetically sealed prototypes was 0.39. The coupling efficiencies of prototypes varied from 0.14 to 0.64. Leak rate of 1 x 10-7 [atm x cm3/s] was measured in the helium leak tests for the final prototype module, when the module was tested according to MIL-STD-883D method 1014.9 specification. Leak rate for the module using a buffer stripper fibre without a rubber guard tube was 3 x 10-9 [atm x cm3/s]. The background helium level before and after the tests was less than 3 x 10-10 [atm x cm3/s]. This clearly higher leak rate in the final module leak measurement is mainly due to the absorbed helium to the fibre polymer buffer layer and rubber guard tube in the pressurization process. Measurements show that the implemented module is hermetic. Cost-of-ownership modelling was performed starting from low production volume up to production of 10 million good modules per year. Module production cost was estimated through COO modelling. Modelling forecasted that the module production can be lower than 10 EUR in high volume production.