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Thin (40–150 nm), highly doped n+ (1019–1020 cm−3) Ga2O3 layers deposited using pulsed laser deposition (PLD) were incorporated into Ti/Au ohmic contacts on (001) and (010) β-Ga2O3 substrates with carrier concentrations between 2.5 and 5.1 × 1018 cm−3. Specific contact resistivity values were calculated for contact structures both without and with a PLD layer having different thicknesses up to 150 nm. With the exception of a 40 nm PLD layer on the (001) substrate, the specific contact resistivity values decreased with increasing PLD layer thickness: up to 8× on (001) Ga2O3 and up to 16× on (010) Ga2O3 compared with samples without a PLD layer. The lowest average specific contact resistivities were achieved with 150 nm PLD layers: 3.48 × 10−5 Ω cm2 on (001) Ga2O3 and 4.79 × 10−5 Ω cm2 on (010) Ga2O3. Cross-sectional transmission electron microscopy images revealed differences in the microstructure and morphology of the PLD layers on the different substrate orientations. This study describes a low-temperature process that could be used to reduce the contact resistance in Ga2O3 devices. [ABSTRACT FROM AUTHOR]

Chemical and electrical measurements of Ti/(010) β-Ga2O3 and Ti/(001) β-Ga2O3 interfaces were conducted as a function of annealing temperature using x-ray photoelectron spectroscopy (XPS), current density–voltage (J–V), and capacitance–voltage (C–V) measurements. XPS revealed partial Ti oxidation at both interfaces in the as-deposited condition, with more Ti oxidation on the (001) β-Ga2O3 epilayer surface than the (010) β-Ga2O3 substrate surface. The amount of oxidized Ti increased with annealing temperature. The Schottky barrier heights for as-deposited (unannealed) Au/Ti/(010) β-Ga2O3 and Au/Ti/(001) β-Ga2O3 contacts as determined from J–V and C–V measurements were between 0.64 and 0.83 eV. Shifts in XPS core level peaks for Ti/(010) β-Ga2O3 suggest that the Schottky barrier height decreases with temperature up to 350 °C for 10-min anneals and increases for 10-min anneals ≥460 °C. Taken together, the results suggest a strong dependence of Ti reactivity on the β-Ga2O3 surface, which can affect the electrical performance and stability of Ti/β-Ga2O3 ohmic contacts at elevated temperatures. [ABSTRACT FROM AUTHOR]

Nanocrystalline tin sulfide (SnS) thin films were deposited by electron-beam evaporation at growth temperatures ranging from room temperature to 300 °C and characterized prior to and after annealing at 300 °C in high vacuum. X-ray diffraction and Raman spectroscopy results indicated that SnS films deposited at 100 and 200 °C contained predominately a mixture of orthorhombic α-SnS and cubic π-SnS phases, whereas only α-SnS was detected in SnS films deposited at 300 °C. Contacts with a range of work functions were deposited onto p-type α-SnS films. All of the contacts investigated (Ti/Au, Ru/Au, Ni/Au, and Au) were ohmic as-deposited and yielded average specific contact resistance values that decreased with increasing metal work function, suggesting that the barrier height has at least a partial dependence on the work functions of the metals. Annealing at 350 °C for 5 min in Ar reduced the specific contact resistance value for Ru/Au contacts, resulting in the lowest value (1.9 × 10−3 Ω cm2) of contacts investigated to SnS thin films. [ABSTRACT FROM AUTHOR]