1. Ultrasonic-induced metallurgical bonding between W90 tungsten heavy alloy and AZ31B Mg alloy using Sn.
- Author
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Zhang, Xudong, Fu, Wei, Song, Xiaoguo, Li, Zhuolin, Long, Weimin, Lin, Danyang, Song, Yanyu, and Zhong, Sujuan
- Subjects
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TIN , *TUNGSTEN alloys , *ALLOYS , *SONICATION , *SOLDER & soldering - Abstract
• W90 and Mg alloy were firstly bonded by ultrasonic-assisted soldering at 250 °C. • A semi-coherent interface was formed between Sn and W. • The joint strength treated with the ultrasonication time of 2 s reached 10.4 MPa. W90 tungsten heavy alloy (W90) and AZ31B Mg alloy were firstly bonded by ultrasonic-assisted soldering using Sn in atmospheric environment. The wetting angle of Sn on W90 decreased to 130.7° under the action of ultrasound. The microstructure of W90/Sn/Mg joint treated with 2 s of ultrasounication time was W90/Mg 2 Sn + Sn/Mg 2 Sn layer/Mg. As the ultrasonication time increased to 4 s, the joint width reduced and the thickness of Mg 2 Sn layer increased. The joint strength decreased from 10.4 MPa to 5.1 MPa as the ultrasonication time increased from 2 s to 4 s. A semi-coherent interface formed at the Sn/W interface as the ultrasound was applied. [ABSTRACT FROM AUTHOR]
- Published
- 2023
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