1. A unified static and dynamic recrystallization Internal State Variable (ISV) constitutive model coupled with grain size evolution for metals and mineral aggregates.
- Author
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Cho, H.E., Hammi, Y., Bowman, A.L., Karato, Shun-ichiro, Baumgardner, J.R., and Horstemeyer, M.F.
- Subjects
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GRAIN size , *MICROSTRUCTURE , *BOUNDARY value problems , *METALS , *MINERAL aggregates , *DEFORMATIONS (Mechanics) - Abstract
Abstract A history dependent and physically-motivated Internal State Variable (ISV) constitutive model is presented that simultaneously accounts for the effects of static recrystallization, dynamic recrystallization, and grain size with respect to the mechanical behavior under different strain rates, temperatures, and pressures. A unique aspect of our ISV constitutive model is that grain size and recrystallized volume fraction can be directly included along with its associated rate of change under deformation and time in a coupled manner. The present ISV constitutive model was calibrated to several metals (oxygen-free high conductivity copper, AZ31 magnesium alloy, pure nickel, and 1010 low carbon steel) and geological materials (olivine and clinopyroxene). The model calibration shows good agreement with the experimental stress-strain behavior and average grain size data. Validation of the ISV constitutive model was accomplished by applying complex and history sensitive thermomechanical problems once the model was calibrated: i) sequential transitions of different loading conditions and ii) a multistage tubing process. The history dependence naturally provided by ISVs enabled the present model to effectively capture the complex boundary value problems with changing boundary conditions. Highlights • An ISV-based model for recrystallization and grain size evolution is formulated. • The model unifies static and dynamic recrystallization with average grain size. • The model is successfully validated for polycrystalline metals and minerals. • The model captures history sensitive sequential boundary value problems. [ABSTRACT FROM AUTHOR]
- Published
- 2019
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