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Start Over Author "Channing Cheng-Lin Yang" Topic microfabrication
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1. Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill.

Author

Tsun-Sheng Chou, Ricky, Lau, John H., Chang-Fu Chen, Gary, Yu-Cheng Huang, Jones, Channing Cheng-Lin Yang, Hsing-Ning Liu, and Tzyy-Jang Tseng

Subjects
SOLDER joints, MICROFABRICATION, PHYSICAL vapor deposition, STAINLESS steel, REFLOW soldering
Abstract

In this study, the heterogeneous integration of two chips on a 2.3D hybrid substrate using solder joint and underfill is investigated. Emphasis is placed on the materials, design, process, fabrication, and reliability of the package. Drop test and results of the package are also provided. [ABSTRACT FROM AUTHOR]

Published
2022
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