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Guiding mechanisms are among the most elementary components of MEMS. Usually, a spring is required to be compliant in only one direction and stiff in all other directions. We introduce triangular springs with a preset tilting angle. The tilting angle lowers the reaction force and implements a constant reaction force. We show the influence of the tilting angle on the reaction force, on the spring stiffness and spring selectivity. Furthermore, we investigate the influence of the different spring geometry parameters on the spring reaction force. We experimentally show tilted triangular springs exhibiting constant force reactions in a large deflection range and a comb-drive actuator guided by tilted triangular springs. [ABSTRACT FROM AUTHOR]

In this paper, we present different microelectromechanical systems based on electrostatic actuators, and demonstrate their capacity to achieve large and stepwise displacements using a cooperative function of the actuators themselves. To explore this, we introduced micro-stepper actuators to our experimental systems, both with and without a guiding spring mechanism; mechanisms with such guiding springs can be applied to comb-drive and parallel-plate actuators. Our focus was on comparing various guiding spring designs, so as to increase the actuator displacement. In addition, we present systems based on cascaded actuators; these are converted to micromechanical digital-to-analog converters (DAC). With DACs, the number of actuators (and thus the complexity of the digital control) are significantly reduced in comparison to analog stepper-actuators. We also discuss systems that can achieve even larger displacements by using droplet-based bearings placed on an array of aluminum electrodes, rather than guiding springs. By commutating the voltages within these electrode arrays, the droplets follow the activated electrodes, carrying platforms atop themselves as they do so. This process thus introduces new applications for springless large displacement stepper-actuators. [ABSTRACT FROM AUTHOR]

In this paper we introduce the concept, modelling and analysis of triangular and sinusoidal springs intended for large in-plane translational displacements for MEMS-guiding applications. The proposed spring systems combine the advantages of minimal space requirement, low stiffness in the axial direction and high mechanical resistance in off-axis directions. An analytical model for the description of the force-displacement characteristic of triangular springs is derived considering typical mechanical constraints. Based on the model, geometrical parameters of the springs influencing linearity and selectivity with respect to the in- and off-axis stiffness are analyzed. The validity of the models is demonstrated by finite element analysis and experimental verification realized by silicon-on-insulator demonstrators. [2020-0360] [ABSTRACT FROM AUTHOR]

We present the design, fabrication, and experimental characterization of microsystems achieving large and stepwise discrete displacements. The systems consist of electrostatic bending plate actuators linked in a chain with increasing electrode gaps to allow a stepwise system displacement. A derived analytic transfer function permits to evaluate the influence of the system components on both the total and the stepwise system displacement. Based on calculation and simulation results, systems featuring 5, 8, 10, 13, and 16 steps are modeled and fabricated using a dicing-free SOI-fabrication process. During experimental voltage- and time-dependent system characterization, the minimum switching speed of the electrostatic actuators is 1 ms. Based on the guiding spring stiffness and the switching time, step-by-step and collective activations of the microsystems are performed and the system properties are derived. Furthermore, we analyze the influence of the number of steps on the total system displacement and present 16-step systems with a total maximum displacement of 230.7 ± 0.9 µm at 54 V. [ABSTRACT FROM AUTHOR]

We present the design, fabrication, and characterization of a MEMS-based 3-bit Digital-to-Analog Converter (DAC) that allows the generation of large displacements. The DAC consists of electrostatic bending-plate actuators that are connected to a mechanical amplifier (mechAMP), enabling the amplification of the DAC output displacement. Based on a parallel binary-encoded voltage signal, the output displacement of the system can be controlled in an arbitrary order. Considering the system design, we present a simplified analytic model, which was confirmed by FE simulation results. The fabricated systems showed a total stroke of approx. 149.5 ± 0.3 µm and a linear stepwise displacement of 3 bit correlated to 23 ≙ eight defined positions at a control voltage of 60 V. The minimum switching time between two input binary states is 0.1 ms. We present the experimental characterization of the system and the DAC and derive the influence of the mechAMP on the functionality of the DAC. Furthermore, the resonant behavior and the switching speed of the system are analyzed. By changing the electrode activation sequence, 27 defined positions are achieved upgrading the 3-bit systems into a 3-tri-state (33) system. [ABSTRACT FROM AUTHOR]