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Thermal modification is the most important commercial modification procedure. Thermally modified (TM) wood has improved durability, but its performance does not meet expectations predominately under moist conditions. To reduce water uptake of TM wood, Norway spruce specimens were treated with suspensions of a natural wax by dipping impregnation (DipI) or by vacuum-pressure impregnation (VPI). Wax-treated specimens were subsequently TM at 185, 200, 215, and 230°C. Control specimens were heated up to 100°C only. Contact angle (CA), short-term and long-term water uptake, bending strength, and performance against wood decay fungi of the resulting material were determined. The results show that a combination of wax treatment and thermal modification have a synergistic effect that considerably improves hydrophobicity, reduces liquid water uptake, slows down water vapor uptake, and improves the resistance against fungal decay of the treated material. [ABSTRACT FROM AUTHOR]

In this study, we modified melamine-formaldehyde (MF) resin adhesive with liquefied wood (LW) and determined the properties of MF–LW adhesive mixtures. Furthermore, we produced particleboards using prepared MF–LW mixtures and evaluated their mechanical and physical properties. Results showed that with increasing content of LW in the adhesive mixture gel time and peak temperature increased while reaction enthalpy decreased. With increasing substitution of MF resin adhesive with LW the thermal stability of adhesive mixture reduced, namely thermal degradation started at lower temperature and weight loss increased. Properties of particleboards improved with increasing amount of LW in the adhesive mixture up to 20% and then deteriorated. Nevertheless, the properties of particleboard with 30% LW in the adhesive mixture were comparable to the properties of particleboard without LW while they worsen at greater portion of LW. Consequently, MF resin adhesive with 30% LW substitution could be used to produce particleboards with suitable mechanical properties and reduced formaldehyde release content. [ABSTRACT FROM PUBLISHER]