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This paper presents the development of a new microgripper actuated by means of rotary-comb drives equipped with two cooperating fingers arrays. The microsystem presents eight CSFH flexures (Conjugate Surface Flexure Hinge) that allow the designer to assign a prescribed motion to the gripping tips. In fact, the adoption of multiple CSFHs gives rise to the possibility of embedding quite a complex mechanical structure and, therefore, increasing the number of design parameters. For the case under study, a double four-bar linkage in a mirroring configuration was adopted. The presented microgripper has been fabricated by using a hard metal mask on a Silicon-on-Insulator (SOI) wafer, subject to DRIE (Deep Reactive Ion Etching) process, with a vapor releasing final stage. Some prototypes have been obtained and then tested in a lab. Finally, the experimental results have been used in order to assess simulation tools that can be used to minimize the amount of expensive equipment in operational environments.

Gyroscopes are one of the next killer applications for the MEMS (Micro-Electro-Mechanical-Systems) sensors industry. Many mature applications have already been developed and produced in limited volumes for the automotive, consumer, industrial, medical, and military markets. Plenty of high-volume applications, over 100 million per year, have been calling for low-cost gyroscopes. Bulk silicon is a promising candidate for low-cost gyroscopes due to its large scale availability and maturity of its manufacturing industry. Nevertheless, it is not suitable for a real monolithic IC integration and requires a dedicated packaging. New designs are supposed to eliminate the need for magnets and metal case package, and allow for a real monolithic MEMS-IC (Integrated Circuit) electronic system. In addition, a drastic cost reduction could be achieved by utilizing off-the-shelf plastic packaging with lead frames for the final assembly. The present paper puts forward the design of a novel tri-axial gyroscope based on rotating comb-drives acting as both capacitive sensors and actuators. The comb-drives are comprised of a single monolithic moving component (rotor) and fixed parts (stators). The former is made out of different concentrated masses connected by curved silicon beams in order to decouple the motion signals. The sensor was devised to be fabricated through the PolyMUMPs&reg, process and it is intended for working in air in order to semplify the MEMS-IC monolithic integration.

Although tissue and cell manipulation nowadays is a common task in biomedical analysis, there are still many different ways to accomplish it, most of which are still not sufficiently general, inexpensive, accurate, efficient or effective. Several problems arise both for in vivo or in vitro analysis, such as the maximum overall size of the device and the gripper jaws (like in minimally-invasive open biopsy) or very limited manipulating capability, degrees of freedom or dexterity (like in tissues or cell-handling operations). This paper presents a new approach to tissue and cell manipulation, which employs a conceptually new conjugate surfaces flexure hinge (CSFH) silicon MEMS-based technology micro-gripper that solves most of the above-mentioned problems. The article describes all of the phases of the development, including topology conception, structural design, simulation, construction, actuation testing and in vitro observation. The latter phase deals with the assessment of the function capability, which consists of taking a series of in vitro images by optical microscopy. They offer a direct morphological comparison between the gripper and a variety of tissues.

This paper presents the first prototype of a new concept nanogripper whose overall size has been reduced as much as permitted by a new fabrication process based on Nano Technology. The jaws lumen size is adequate to the mechanical manipulation of microorganisms colonies.

Progress in MEMS Technology continuously stimulates new developments in the mechanical structure of micro systems, such as, for example, the new concept so-called CSFH (Conjugate Surfaces Flexural Hinge), which makes it possible, simultaneously, to minimize the internal stresses and to increase motion range and robustness. Such hinge may be actuated by means of a rotary comb-drive, provided that a proper set of simulations and tests are capable to assess its feasibility. In this paper, a CSFH has been analyzed with both theoretical and Finite Element (FEM) methods, in order to obtain the relation between voltage and generated torque. The FEM model, realized with an APDL code (ANSYS Parametric Design Language), considers also the fringe effect on the comb drive finger. Electromechanical couple field analysis is performed by means of both Direct and Load Transfer Methods. Experimental tests have been also performed on a CSFH embedded in a MEMS prototype, which has been fabricated starting from a SOI wafer and using D-RIE(Deep Reactive Ion Etching). Results showed that CSFH performs better than linear fexure hinges in terms of larger rotations and less stress for given applied voltage.

This paper presents a new concept flexure hinge for MEMS applications and reveals how to design, construct, and experimentally test. This hinge combines a curved beam, as a flexible element, and a pair of conjugate surfaces, whose contact depends on load conditions. The geometry is conceived in such a way that minimum stress conditions are maintained within the flexible beam. A comparison of the new design with the other kind of revolute and flexible joints is presented. Then, the static behavior of the hinge is analyzed by means of a theoretical approach, based on continuum mechanics, and the results are compared to those obtained by means of finite element analysis (FEA) simulation. A silicon hinge prototype is also presented and the construction process, based on single step lithography and reactive ion etching (RIE) technology, is discussed. Finally, a crucial in–SEM experiment is performed and the experimental results are interpreted through the theoretical models.

Although a certain amount of work has been presented in literature which concerns micro and nano tribology, few contributions have been dedicated to the development of experimental set up for friction assessment in MEMS. The present paper offers a contribution which attempts to fill this gap: the proposal of a new concept design of a micro-tribometer for testing silicon-silicon sliding in MEMS devices, particularly in those obtained via D-RIE process. Since the general contact conditions at the macro scale are very different from those which characterize MEMS, the proposed tribometer is very different from the classic pin-on-disk or block-on-ring. For this reason, a dedicated MEMS has been built, whose only purpose is recreating silicon-silicon sliding under prescribed loads and, then, assessing friction and wear. Since most of MEMS have planar relative motion, the tribometer presented in this article is able study only planar relative motions, and so it has been essentially based on a the creation of a pair of conjugate profiles, whose relative motion has been obtained by using Finite Element Analysis (FEA) simulations, rather than by the classical centrodes theory.Copyright © 2014 by ASME

The need of micromanipulation devices has been growing rapidly during the last decades, specially in the fields of Biology and Micro-Assembly, and many solutions have been proposed to cope with the increasing demand. The present paper suggests a possible way to micromanipulating objects in various conditions, adopting MEMS technologies to develop a microgripper based on a new flexural hinge, recently patented by the Authors. The micromechanism has been modified considering results obtained through FEA. Finally, a brief description of the construction process is provided, together with some experimental activities.

In this work it is described an high-density contacting technology that can replace wire bonding in power electronic applications, to overcome known limitation of bond wires liftoff occurring after several power cycles due to the difference in the coefficient of thermal expansion of silicon and aluminum. In the presented technology, MEMS (micro-electro-mechanics systems) micro-fabrication processes are used to realize contact structures that, pressed against the silicon dice, provide a reliable compliant contact. One advantage of this technology is that the contacts can be hosted on a printed circuit board that integrates the control circuitry for the power devices. This will reduce the footprint of power systems, like Integrated High Power Modules (IHPM). Reduced footprints are beneficial in applications where space is a concern, like the automotive industry. The description of the technological steps for building the contacting assembly is reported together with process conditions and electrical performances of two test structures.

Microrobots are used nowadays in several fields of application, specially in mini invasive surgery. However, they are rather difficult to be constructed, and the traditional micro machining tools are not adequate yet to built the smaller parts. The construction of the microrobots is even harder if more than one D.O.F. are required for the mechanism, because these systems are more complicated. This paper deals with the development of a 3 D.O.F. planar micro platform with remote system of actuation. The new approach of design and manufacturing is based on two innovative solutions: a) the adoption of the technologies used to built MEMS, Micro Electro Mechanical Systems; b) the introduction of new flexural hinge to develop compliant micro mechanisms. The new concept of flexural hinge is described in the paper, also from a theoretical point of view. Several example of possible structures are proposed and analyzed, together with their remote wire actuation systems. Finite Element Analysis (FEA) has been also adopted to analyze the system performance under small deformations. The principle of fabrication is, then, described. The process consists of a sequence of single steps which have allowed to achieved an overall maximum size down to 3–4 mm and the minimum thickness of the smaller components down to 50µm.