1. Coupling of Lamb Waves and Spin Waves in Multiferroic Heterostructures
- Author
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Andres C. Chavez, Sebastian Wintz, Joseph D. Schneider, Sri Sai Phani Kanth Arekapudi, Olav Hellwig, Greg P. Carman, Rob N. Candler, Sidhant Tiwari, Jürgen Lindner, and Kilian Lenz
- Subjects
Materials science ,Condensed matter physics ,Mechanical Engineering ,Attenuation ,020206 networking & telecommunications ,Magnetostriction ,02 engineering and technology ,021001 nanoscience & nanotechnology ,Ferromagnetic resonance ,Magnetic field ,Condensed Matter::Materials Science ,Lamb waves ,Spin wave ,0202 electrical engineering, electronic engineering, information engineering ,Ferrite (magnet) ,Multiferroics ,Physics::Atomic Physics ,Electrical and Electronic Engineering ,0210 nano-technology - Abstract
In this work, we investigate magneto-acoustic attenuation in thin film multiferroic Lamb wave delay lines. By leveraging magneto-acoustic interactions, multiferroics have potential to realize passive chip-scale alternatives to bulky ferrite devices. For the first time, magnetic field dependence of magneto-acoustic interactions in multiferroic Lamb wave devices is characterized. Multiferroic heterostructures of aluminum nitride and cobalt iron boron are fabricated into Lamb wave delay lines operating at 7.492 GHz to study the effect of strain nonuniformity on the multiferroic coupling. The attenuation of the Lamb waves is characterized as a function of the magnitude and angle of an applied in-plane bias magnetic field. It is found that the bias magnitude for peak attenuation is a strong function of angle, indicating that it is due to coupling between the Lamb waves and spin wave modes. This is in contrast with current models of attenuation in multiferroic SAW delay lines, where the uniform surface strains couple to ferromagnetic resonance, which has no angular dependence on the in-plane bias field magnitude. These results are the first steps towards passive chip-scale alternatives to ferrite devices utilizing Lamb wave devices, which have better coupling and scalability than their SAW counterparts. [2020-0114]
- Published
- 2020
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