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We propose a high-capacity polymer-based optical and electrical LSI package integrated with multimode Si photonic transmitters and receivers. We describe the fabrication and characteristics of the polymer-based hybrid LSI package substrate with a polymer optical waveguide, a mirror, and optical card edge connectors. We fabricated optical mirrors with several angles ranging from 40° to 45° for the Si photonic grating coupler by using a dicing blade at an angle. The dicing mirror changed the emission angle for the grating coupler. We also realized a large lateral misalignment tolerance (±11.5 μm) between the polymer waveguide and MMF for 1 dB of excess loss at 24 channels. We obtained 1-dB coupling loss using an optical card edge connector at 1.3 μm because of the large tolerance. We realized 25-Gb/s error-free transmission per channel at 1.3 μm. We also describe here the error penalty and jitter due to modal noise generated by coupling mismatch.

Efficient, broadband, and polarization-independent optical input/output (I/O) coupling of silicon photonics chips is significant for its practical application, and single-mode vertical optical I/O coupling will be necessary for high-density optical I/O connections required in future high-performance computing systems. We demonstrated such optical coupling using a 45° mirror, which was integrated by a cost-effective dicing technique with a polishing process. The 45° mirrors were integrated into Si-rich silica (SiOx) waveguides on a Si substrate. To evaluate the light beam profile, which was important factor for the single-mode optical coupling, we measured near field patterns and far field patterns of light beams reflected by the 45° mirror. Owing to the polishing process, high-quality single-mode beams were successfully obtained as the vertical optical output. Using the fabricated 45° mirrors, the efficient single-mode vertical optical coupling with loss penalty of around 0.3 dB was demonstrated. The wavelength-dependent loss was less than 0.6 and 0.2 dB for TE and TM polarization, respectively. The polarization-dependent loss was also very small and it was less than 0.2 dB in 1500–1600 nm.

We propose a polymer-based optical and electrical hybrid LSI package integrated with silicon photonic chips. We fabricated hybrid package substrate with polymer optical waveguide and card edge connector. We realized a 25-Gbps per channel error-free transmission at 1.3-µm.

Efficient vertical optical coupling of a silicon photonics chip was demonstrated with Si integrated 45 degree mirror. Additional coupling loss was around 1.2 dB over broadband wavelength of 1450–1650 nm for TE/TM polarization.