1. Enhanced tensile ductility of tungsten microwires via high-density dislocations and reduced grain boundaries
- Author
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Ji-Jung Kai, H.K. Yang, Hongti Zhang, Sufeng Fan, Chaoqun Dang, Yang Lu, Weitong Lin, Zhengjie Fan, Fanling Meng, Ke Cao, Xiaocui Li, and Wenzhao Zhou
- Subjects
Materials science ,Polymers and Plastics ,Mechanical Engineering ,Metals and Alloys ,chemistry.chemical_element ,02 engineering and technology ,Tungsten ,Plasticity ,010402 general chemistry ,021001 nanoscience & nanotechnology ,01 natural sciences ,0104 chemical sciences ,Brittleness ,chemistry ,Mechanics of Materials ,Materials Chemistry ,Ceramics and Composites ,Grain boundary ,Composite material ,Dislocation ,0210 nano-technology ,Ductility ,Electron backscatter diffraction ,Tensile testing - Abstract
Despite being strong with many outstanding physical properties, tungsten is inherently brittle at room temperature, restricting its structural and functional applications at small scales. Here, a facile strategy has been adopted, to introduce high-density dislocations while reducing grain boundaries, through electron backscatter diffraction (EBSD)-guided microfabrication of cold-drawn bulk tungsten wires. The designed tungsten microwire attains an ultralarge uniform tensile elongation of ~10.6%, while retains a high yield strength of ~2.4 GPa. in situ TEM tensile testing reveals that the large uniform elongation of tungsten microwires originates from the motion of pre-existing high-density dislocations, while the subsequent ductile fracture is attributed to crack-tip plasticity and the inhibition of grain boundary cracking. This work demonstrates the application potential of tungsten microcomponents with superior ductility and workability for micro/nanoscale mechanical, electronic, and energy systems.
- Published
- 2021
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