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On-chip avalanche photodetectors (APDs) are attractive for a sensitive detection of high-speed data light signals with low intensities. Silicon-germanium (Si-Ge) APDs are leading candidates to build reliable short-reach optical links. Appeal for Si-Ge APDs stems from larger (lower) gain-bandwidth (excess noise) at reduced voltages, CMOS-compliant production, and monolithic integration compared to their III-V alternatives [1] - [5] . Typically, Si-Ge APDs are metal-semiconductor-metal (MSM) [3] , separate absorption charge multiplication (SACM) [4] , or p-i-n [5] devices - each of them having their own advantages and drawbacks [1] . Although many Si-Ge APDs have appealing performances on their own, they are usually operated with other electronic components such as amplification stages, impeding low power consumption and low-cost detection on Si chips.

Segmenting silicon waveguides at the subwavelength scale produce an equivalent homogenous material. The geometry of the waveguide segments provides precise control over modal confinement, effective index, dispersion and birefringence, thereby opening up new approaches to design devices with unprecedented performance. Indeed, with ever-improving lithographic technologies offering sub-100-nm patterning resolution in the silicon photonics platform, many practical devices based on subwavelength structures have been demonstrated in recent years. Subwavelength engineering has thus become an integral design tool in silicon photonics, and both fundamental understanding and novel applications are advancing rapidly. Here, we provide a comprehensive review of the state of the art in this field. We first cover the basics of subwavelength structures, and discuss substrate leakage, fabrication jitter, reduced backscatter, and engineering of material anisotropy. We then review recent applications including broadband waveguide couplers, high-sensitivity evanescent field sensors, low-loss devices for mid-infrared photonics, polarization management structures, spectral filters, and highly efficient fiber-to-chip couplers. We finally discuss the future prospects for subwavelength silicon structures and their impact on advanced device design.

Integrated silicon nanophotonics has progressed a lot over past decades with great promises for many surging applications in optoelectronics, information and communication technologies, sensing or health monitoring. Enabling low-cost, dense integration, and compatibility with modern semiconductor nanofabrication processes, silicon nanophotonics deliver compact and high-performance devices on single chips. A variety of nanophotonic functionalities, both passive and active, are nowadays available on semiconductor substrates, leveraging the maturity of open-access silicon foundries and epitaxial germanium integration. It encompasses essential functions such as light generation and amplification, fast electro-optical modulation, and reliable conversion of optical into electrical signals. Germaniumbased optical photodetectors are main building blocks within the library of integrated silicon nanophotonics, with performances that are nowadays on par with their III-V-based counterparts. Germanium photodetectors integrated at the end of waveguides are attractive for next-generation on-chip interconnections, because of their compactness, bandwidth and speed, energy consumption and cost. In this work, we present our latest advances on silicon-germanium p-i-n waveguide-integrated photodetectors based on lateral silicon-germanium-silicon heterojunctions. Our hetero-structured photodetectors were fabricated on top of 200-mm silicon-on-insulator substrates using industrial-scale fabrication processes compatible with complementary metal-oxide-semiconductor technology. Silicon-germanium p-i-n photodetectors operated under low bias voltages exhibited low dark-currents (~100 nA), cut-off frequencies beyond 50 GHz, and photo-responsivities of about 1.2 A/W. Photodetector sensitivities of -14 dBm and -11 dBm were achieved for communication data rates of 10 Gbps and 25 Gbps, respectively. P-i-n photodetectors with lateral heterojunction operated in an avalanche regime offered an additional degree of freedom to improve device performances. High-speed and low-noise characteristics were obtained in our p-i-n photodetectors upon avalanche operation, with a gain-bandwidth product of 210 GHz and a low carrier impact ionization ratio of about 0.25. The measured sensitivity of avalancheoperated devices was -11 dBm for 40 Gbps signal detection. As demonstrated in the reported achievements, heterostructured p-i-n photodetectors are thus suitable communication devices in future intra-data center links or high-speed optical interconnects.

Polarization mode dispersion is recognized as a key factor limiting optical transmission systems, particularly those fiber links that run at bit rates beyond 10 Gbps. In-line test and characterization of polarization mode dispersion are thus of critical importance to evaluate the quality of installed optical fibers that are in use for high-speed signal traffics. However, polarization-based effects in optical fibers are stochastic and quite sensitive to a range of environmental changes, including optical cable movements. This, in turn, gives rise to undesired variations in light polarization that adversely impair the quality of the signal transmission in the link. In this work, we elaborate on experimental testing and theoretical analysis to asses changes of polarization mode dispersion in optical fibers that are caused by environmental variations, here wind gusts in particular. The study was performed on commercially harnessed optical fibers installed within optical power ground wire cables, taking into account different weather conditions. More specifically, we showed that changes caused by wind gusts significantly influence the differential group delay and the principal state of polarization in those optical fibers. For this, we experimentally measured a number of parameters to characterize light polarization properties. Measurements were carried out on C-band operated fiber-optic link formed by 111-km-long power ground wire cables and 88 spectral channels, with a test time step of 1 min during 12 consecutive days. Variations in differential group delay allowed for sensitive testing of environmental changes with measured maxims up to 10 ps under the worst wind conditions. Moreover, measured parameters were used in a numerical model to assess the quality of transmitted high-bit-rate optical signals as a function of wind conditions. The analysis revealed a negligible impact of wind on a 10 Gbps transmission, while substantial influence was noticed for higher bit rates up to 100 Gbps. These results show promises for efficient sensing of environmental changes and subsequent monitoring of the quality of recently used fiber-optic link infrastructures.

The Si transparency (1.1 μm – 8 μm wavelength) contains the strongest absorption features of a wide range of chemical and biological substances. However, the use of SOI in the mid-IR is hampered by the large absorption of the buried oxide (BOX) for wavelengths above 4 μm. Silicon membranes have garnered great interest for their unique capability to overcome the BOX limitation while leveraging the advantages of Si photonics. On the other hand, silicon is uniquely poised for the implementation of wideband mid-IR sources based on nonlinear frequency generation. Promising supercontinuum and frequency comb generation have already been demonstrated in Si. Still, current implementations have a limited flexibility in the engineering of phase-matching conditions and dispersion, which complicates the shaping of the nonlinear spectrum. Patterning Si with features smaller than half of the wavelength (well within the capabilities of standard large-volume fabrication processes) has proven to be a simple and powerful tool to implement metamaterials with optimally engineered properties. Here, we present the design of nanostructured silicon membrane waveguides with ultra-wideband flat anomalous dispersion in a wavelength span exceeding 5 µm. Our three-dimensional finite difference time domain (FDTD) calculations predict flat anomalous dispersion near 50 ps/km⋅nm between 2.5 µm and 8 µm wavelength. These results illustrate the potential of subwavelength metamaterial engineering to control chromatic dispersion in Si membrane waveguides. This is a promising step towards the implementation of wideband nonlinear sources in the mid-IR for silicon photonics.

International audience; The strong evolution of silicon photonics towards very low power consumption circuits leads to the development of new strategies for photonic devices, especially for power-hungry components such as optical modulators. One strategy is to use Pockels effect in Si waveguides. However, bulk Si is a centrosymmetric semiconductor, which cannot exhibit any second order optical nonlinearities. Nonetheless, under a strain gradient, generated by depositing a stressed layer on Si waveguides, this restriction vanishes. In our work, we experimentally demonstrated a Pockels effect based electro-optic modulation at high frequency (> 5GHz) using a strained silicon Mach-Zehnder modulator.

Silicon nanophotonics represents a scalable route to deploy complex optical integrated circuits for multifold applications, markets, and end-users. Most recently, applications such as optical communications and interconnects, sensing, as well as quantum-based technologies, among others, present additional opportunities for integrated silicon nanophotonics to expand its frontiers from laboratories to industrial product development. Within a wide set of functionalities that silicon nanophotonic chips can afford, the availability of low-loss optical input/output interfaces has been regarded as a major practical obstacle that hampers long-term success of integrated photonic platforms. Indeed, fiber-chip interfaces based on diffraction gratings are an attractive solution to resonantly couple the light between planar waveguide circuits and standard single-mode optical fibers. Surface grating couplers provide much more alignment tolerance in fiber attach compared with most conventional edge-coupled alternatives, while retaining the much-needed control of the fiber placement on the chip surface and wafer-level-test capability that the in-plane convertors lack. Here, we report on our recent advances in the development of high-performance fiber-chip grating couplers that exploit the blazing effect. This is achieved with well-established dual-etch processing in interleaved teeth-trench arrangements or using L-shaped grating-teeth-profile geometries. The first demonstration of the L-shaped-based grating coupler yielded a coupling loss of -2.7 dB, seamlessly fabricated into a 300-mm foundry manufacturing process using 193-nm deep-ultraviolet stepper lithography. Moreover, silicon metamaterial L-shaped fiber couplers may promote robust sub-decibel coupling of light, reaching a simulated coupling loss of -0.25 dB, while featuring device layouts (>120 nm) compatible with lithographic technologies in silicon semiconductor foundries., SPIE OPTO 2020 - Smart Photonic and Optoelectronic Integrated Circuits XXII, February 3-6, 2020, San Francisco, California, Series: Proceedings of SPIE

We report on the first demonstration of high-speed optical modulation exploiting Pockels effect in strained silicon waveguides. Bandwidths larger than 20 GHz and low insertion loss have been achieved at a wavelength of 1550 nm.

Silicon photonics, considered as a major photonic platform for optical communications in data centers, is today also developed for others applications including quantum photonics and sensing. Advanced silicon functionalities based on optical nonlinearities are then required. As the presence of inversion symmetry in the Si crystal structure prevents the exploitation of second-order optical nonlinearities, the generation of strain gradients in Si by a stressed material can be considered. However, due to the semiconductor nature of silicon with the presence of carriers, no clear evidence of second-order nonlinearities have been reported yet. Here we report an experimental demonstration of high-speed Pockels effect in silicon waveguides at 1550 nm. Additionally, a theoretical model is developed to describe its frequency behavior. A second-order nonlinear susceptibility $$\chi _{xxy}^{(2)}$$ χ x x y ( 2 ) of −1.8 ± 0.2 pm V−1 is then experimentally determined. These results pave the way for the development of fast linear electro-optic effect for advanced silicon photonics devices.

International audience; The availability of low-loss optical interfaces to couple light between standard optical fibers and high-index-contrast silicon waveguides is essential for the development of chip-integrated nanophotonics. Input and output couplers based on diffraction gratings are attractive coupling solutions. Advanced grating coupler designs, with Bragg or metal mirror underneath, low-and high-index overlays, and multi-level or multi-layer layouts, have proven less useful due to customized or complex fabrication, however. In this work, we propose a rather simpler in design of efficient off-chip fiber couplers that provide a simulated efficiency up to 95% (−0.25 dB) at a wavelength of 1.55 µm. These grating couplers are formed with an L-shaped waveguide profile and synthesized subwavelength grating metamaterials. This concept jointly provides sufficient degrees of freedom to simultaneously control the grating directionality and out-radiated field profile of the grating mode. The proposed chip-to-fiber couplers promote robust sub-decibel coupling of light, yet contain device dimensions (> 120 nm) compatible with standard lithographic technologies presently available in silicon nanophotonic foundries. Fabrication imperfections are also investigated. Dimensional offsets of ± 15 nm in shallow-etch depth and ± 10 nm in linewidth's and mask misalignments are tolerated for a 1-dB loss penalty. The proposed concept is meant to be universal, which is an essential prerequisite for developing reliable and low-cost optical couplers. We foresee that the work on L-shaped grating couplers with sub-decibel coupling efficiencies could also be a valuable direction for silicon chip interfacing in integrated nanophotonics.

Uniform grating couplers based on versatile L-shaped waveguides are experimentally demonstrated, with coupling loss of -2.7 dB and back-reflections of -20 dB. Apodized couplers with subwavelength-grating metamaterials predict improved fiber-chip coupling down to -0.46 dB within device layouts compatible with lithographic technologies available in nanophotonic foundries., 2019 IEEE 16th International Conference on Group IV Photonics (GFP), August 28-30, 2019, Singapore, Singapore

We report mid-infrared Ge-on-Si waveguide based PIN diode modulators operating at wavelengths of 3.8 μm and 8 μm. Fabricated 1 mm-long electro-absorption devices exhibit a modulation depth of >35 dB with a 7 V forward bias at 3.8 μm, and a similar 1 mm-long Mach-Zehnder modulator has a Vπ·L of 0.47 V·cm. Driven by a 2.5 Vpp RF signal, 60 MHz On-Off Keying modulation was demonstrated. Electro-absorption modulation at 8 μm was demonstrated preliminarily, with the device performance limited by large contact separation and high contact resistance.

Sub-wavelength gratings, segmented resonant-less structures with geometries featuring scales considerably smaller than the wavelength of light, have enabled an attractive technological concept to locally control light guiding properties in planar silicon chip architectures. This concept has allowed for additional degrees of freedom to tailor effective mode index, modal confinement, waveguide dispersion, as well as anisotropy, thereby providing a vital route towards high performing devices with engineered optical properties. Sub-wavelength integrated nanophotonics has opened up new horizons for realization of key building components that afford outstanding device performances, typically beyond those achieved by conventional design strategies, yet favorably benefiting from the sub-100-nm pattern resolution of established semiconductor manufacturing tools in nanophotonic foundries. The distinctive features of sub-wavelength grating structures are considered essential for future generation of chip-scale applications in optical communications and interconnects, biomedicine, as well as quantum-based technologies. In this work, we report recent advances in the development of high-performance on-chip nanophotonic waveguides and devices engineered with the sub-wavelength grating metamaterial structures. In particular, we discuss recent achievements of low-loss waveguides with controlled chromatic dispersion, high-efficiency fiber-to-chip surface grating couplers, micro-ring resonators, and grating-assisted waveguide filters, implemented on the mature silicon-on-insulator technology., Integrated Optics: Design, Devices, Systems and Applications, April 1-4, 2019, Prague, Czech Republic, Series: Proceedings of SPIE; no. 11031

International audience; Hetero-structured silicon-germanium-silicon photodetectors operating under low-reverse-voltages with high responsivity, fast response, and low dark-current levels are reported. A bit-error-rate of 10-9 is experimentally achieved for conventional data rates of 10, 20, and 25 Gbps, providing optical power sensitivities of-13.9,-12.7, and-11.3 dBm.

International audience; Wideband and polarization-independent wavelength filters with low sensitivity to temperature variations have great potential for wavelength division multiplexing applications. However, simultaneously achieving these metrics is challenging for silicon-on-insulator photonics technology. Here, we harness the reduced index contrast and the low thermo-optic coefficient of silicon nitride to demonstrate waveguide Bragg grating filters with wideband apolar rejection and low thermal sensitivity. Filter birefringence is reduced by judicious design of a triangularly shaped lateral corrugation. Based on this approach, we demonstrate silicon nitride Bragg filters with a measured polarization-independent 40 dB optical rejection with negligible off-band excess loss, and a sensitivity to thermal variations below 20 pm/°C.

International audience; Near-infrared germanium (Ge) photodetectors monolithically integrated on top of silicon-on-insulator substrates are universally regarded as key enablers towards chip-scale nanophotonics, with applications ranging from sensing and health monitoring to object recognition and optical communications. In this work, we report on the highdata-rate performance pin waveguide photodetectors made of a lateral hetero-structured silicon-Ge-silicon (Si-Ge-Si) junction operating under low reverse bias at 1.55 mu m. The pin photodetector integration scheme considerably eases device manufacturing and is fully compatible with complementary metal-oxide-semiconductor technology. In particular, the hetero-structured Si-Ge-Si photodetectors show efficiency-bandwidth products of similar to 9 GHz at -1 V and similar to 30 GHz at -3 V, with a leakage dark current as low as similar to 150 nA, allowing superior signal detection of high-speed data traffic. A bit-error rate of 10(-9) is achieved for conventional 10 Gbps, 20 Gbps, and 25 Gbps data rates, yielding optical power sensitivities of -13.85 dBm, -12.70 dBm, and -11.25 dBm, respectively. This demonstration opens up new horizons towards cost-effective Ge pin waveguide photodetectors that combine fast device operation at low voltages with standard semiconductor fabrication processes, as desired for reliable on-chip architectures in next-generation nanophotonics integrated circuits.

We report on experimental results of silicon micro-ring resonators based on non-resonant photonic metamaterial waveguides. High extinction ratio up to 30 dB and loaded Q-factors in a range of 1500 to 6000 were achieved at a wavelength of 1550nm.

Subwavelength grating (metamaterial) waveguide devices are becoming established as key building blocks for advanced integrated photonic circuits. In this talk we will present an overview of our recent advances in this surging field.

With the fast growing demand of data, current chip-scale communication systems based on electrical links suffer rate limitations and high power consumptions to address these new requirements. In this context, Silicon Photonics has proven to be a viable alternative by replacing electronic links with optical ones while taking advantage of the well-established CMOS foundries techniques to reduce fabrication costs. However, silicon, in spite of being an excellent material to guide light, its centrosymmetry prevents second order nonlinear effects to exist, such as Pockels effect an electro-optic effect extensively used in high speed and low power consumption data transmission. Nevertheless, straining silicon by means of stressed thin films allows breaking the crystal symmetry and eventually enhancing Pockels effect. However the semiconductor nature of silicon makes the analysis of Pockels effect a challenging task because free carriers have a direct impact, through plasma dispersion effect, on its efficiency, which in turn complicates the estimation of the second order susceptibility necessary for further optimizations. However, this analysis is more relaxed working in high-speed regime because of the frequency limitation of free carriers-based modulation. In this work, we report experimental results on the modulation characteristics based on Mach-Zehnder interferometers strained by silicon nitride. We demonstrated high speed Pockels-based optical modulation up to 25 GHz in the C-band.

Silicon photonics is considered an enabling technology for next generation datacom applications, providing ultra-compact and high-bandwidth transceivers that are cost-effectively fabricated at the existing CMOS facilities. Among photonic devices developed in silicon, Bragg gratings are routinely used for the realization of key functionalities including wavelength filtering, dispersion engineering and sensing. However, the realization of Bragg filters that simultaneously provides narrowband operation and high rejection remains a challenge in the Si platform. Indeed, the small core size of Si wires, together with the high index contrast between the silicon and the oxide cladding results in a strong interaction of the optical mode with the Bragg structure. Several approaches have been proposed to implement narrowband Bragg filters in Si wires including ultra-small corrugations (a few nanometres), periodic claddings, sub-wavelength engineering or inter-mode coupling. Nevertheless, these filters typically have comparatively weak light rejection performance due to fabrication errors limiting the accurate control of the grating geometry over few millimeter-long waveguide structures. In this work, we present a novel waveguide Bragg grating geometry that leverages the large index contrast between Si and air in membrane waveguides to overcome these limitations, yielding both narrow bandwidth and high rejection ratio. We use a novel waveguide corrugation geometry that radiates out the higher order modes, allowing effective single-mode operation for micrometric fully etched membrane waveguides. The high mode confinement of these waveguides results in weak interaction with the sidewall corrugation, thus narrowband operation is achieved. On the other hand, the high rejection ratio is achieved by combining reflection and radiation effects within the Bragg resonance. Based on this concept, we designed and experimentally demonstrated notch filters in single-etch suspended Si waveguides with cross-sections as large as 0.5 µm (height) by 1.1 µm (width). We show a narrow bandwidth of 4 nm for a 500 nm wide corrugation, with a high rejection ratio exceeding 50 dB for a filter length of only 700 µm

International audience; The mid infrared (MIR) region, which ranges from 2 µm to 20 µm, has attracted a lot of interest, particularly for novel applications in medical diagnosis, astronomy, chemical and biological sensing or security, to name a few. Most recently, Germanium-rich Silicon Germanium (Ge-rich SiGe) has emerged as a promising waveguide platform to realize complex mid-IR photonic integrated circuits. The Ge-rich SiGe graded buffer benefits from a wide transparency window, strong 3rd order nonlinearity, and the compatibility with mature large-scale fabrication processes, which in turn, paves the way for the development of mid-IR photonic devices that afford improved on-chip functionalities, altogether with compact footprints and cost-effective production. Albeit, low-loss waveguides and wideband Mach-Zehnder interferometers (MZIs) have been recently successfully demonstrated at mid-IR wavelengths, the coupling of light between external access ports, typically optical fibers, and integrated circuits remains challenging. Surface grating couplers provide technologically attractive scenario for light coupling, since they allow flexible placement on the chip, thereby enabling automatic testing of fabricated devices on a wafer-scale, preferred for large-volume developments. In this work, we report two designs for surface grating couplers implemented on the Ge-rich SiGe graded buffer. The grating couplers are designed for transverse electric (TE) and transverse magnetic (TM) polarizations, respectively, both operating at 7.5 µm wavelength. In particular, the TE-designed grating coupler with an inverse taper excitation arrangement yields a coupling efficiency of 6.3% (-12 dB), a 1-dB bandwidth of 300 nm, and reduced back-reflection less than 1%. Furthermore, the TM-designed grating coupler with a conventional taper injection stage predicts an improved coupling performance up to 11% (-9.6 dB), with a 1-dB bandwidth of 310 nm, and only 1% back-reflection. These results open up the way for the realization of complex and multifunctional photonics integrated circuits on Ge-rich SiGe platform with operation at mid-IR wavelengths.

We report on the co-integration of an additional passive layer within a Silicon Photonic chip for advanced passive devices. Being a CMOS compatible material, Silicon Nitride (SiN) appears as an attractive candidate. With a moderate refractive index contrast compared to SOI, SiN based devices would be intrinsically much more tolerant to fabrication errors while keeping a reasonable footprint. In addition, it's seven times lower thermo-optical coefficient, relatively to Silicon, could lead to thermal-tuning free components. The co-integration of SiN on SOI has been explored in ST 300mm R&D photonic platform DAPHNE and is presented in this paper. Surface roughness of the SiN films have been characterized through Atomic Force Microscopy (AFM) showing an RMS roughness below 2nm. The film thickness uniformity have been evaluated by ellipsometry revealing a three-sigma of 21nm. Statistical measurements have been performed on basic key building blocks such as SiN strip waveguide showing propagation loss below 0.7dB/cm and 40µm radius bends with losses below 0.02dB/90°. A compact Si-SiN transition taper was developed and statistically measured showing insertion losses below 0.17dB/transition on the whole O-band wavelength range. Moreover, advanced WDM devices such as wavelength-stabilized directional couplers (WSDC) have been developed.

Silicon photonics is being considered as the future photonic platform for low power consumption optical communications. However, silicon is a centrosymmetric crystal, i.e. silicon doesn’t have Pockels effect. Nevertheless, breaking the crystal symmetry of silicon can be used to overcome this limitation. In this work, the crystal modification is achieved by depositing a SiN high-stress overlayer. Recent results on high-speed measurements will be presented and discussed. Both charge effects and Pockels effect induced under an electric field will be also analyzed.

Optical signal modulation is presently done using Si pn junctions which cause phase shifting due to Soref effect and, put in a Mach-Zehnder configuration, produce interference and generate amplitude modulation. The drawback of pn junctions is the relatively low phase shifting efficiency which consequently inflicts high power consumptions on the electrical driver. An alternative device to pn junctions was developed and consists of introducing capacitive structures within the optical waveguide. The proposed device has the same cross-section foot-print but is much shorter due to improved efficiencies. Typical pn-junctions can generate phase shifts of 60°/mm for the same implantation conditions. The device is made up of crystal Si, a thin SiO2 capacitor dielectric and poly-Si. Benchmarking the two phase shifters with respect to insertion losses, we observe that the proposed device is promising. Another material exhaustively used in CMOS technologies is Si3N4. In the data-communication bandwidths, the index contrast between Si3N4 (n = 1.95) and SiO2 (n=1.45) is smaller than that with Si (n = 3.5). Thus, nitride waveguides have lower optical mode confinements and are thus less sensitive to insertion losses caused by line edge roughness and wavelength shifting incurred by process variations. Moreover, the temperature induced index variations are 5 times les in Si3N4 than Si. Therefore, the use of nitride to fabricate devices in silicon photonics looks advantageous. However, high speed electro-optic devices are challenging in Si3N4. Consequently, a co-integration of both materials is essential. We developed a fabrication method and associated devices which allow to transfer the signal to and fro Si and Si3N4. We present some devices in each layer to illustrate the benefits.

Recent works towards the development of Ge-rich SiGe photonic integrated circuits will be presented, such as the demonstration of low-loss waveguides and ultra-wideband Mach Zehnder interferometer from 5.5 to 8.6 μm wavelength, as well as the first steps towards the realization of efficient wideband optical sources.

International audience; Taking advantage of unique molecular absorption lines in the mid-infrared fingerprint region and of the atmosphere transparency window (3-5 µm and 8-14 µm), mid-infrared silicon photonics has attracted more research activities with a great potential for applications in different areas, including spectroscopy, remote sensing, free-space communication and many others. However, the demonstration of resonant structures operating at long-wave infrared wavelengths still remains challenging. Here, we demonstrate Bragg grating-based Fabry-Perot resonators based on Ge-rich SiGe waveguides with broadband operation in the mid-infrared. Bragg grating waveguides are investigated first at different wavelengths from 5.4 µm up to 8.4 µm, showing a rejection band up to 21 dB. Integrated Fabry-Perot resonators are then demonstrated for the first time in the 8 µm-wavelength range, showing Q-factors as high as 2200. This first demonstration of integrated mid-infrared Fabry-Perot resonators paves the way towards resonance-enhanced sensing circuits and non-linear based devices at these wavelengths.

International audience; Wideband polarization beam splitters (PBS) are a key building block in polarization management circuits for wavelength division multiplexing applications. A broadband PBS on a 300-mm silicon nitride (SiN) photonic platform is reported based on phase-controlled directional coupler (DC). Unlike classical DC-based PBS made on silicon, the proposed configuration leverages the comparatively lower birefringence in SiN to yield wideband and efficient splitting. A semi-analytical approach, based on transfer matrix modeling and 3-D finite difference time domain, has been used to design and optimize the structure for O-band operation. The proposed PBS has been experimentally demonstrated showing insertion loss (IL) lower than 0.6 dB and extinction ratio (ER) as high as 10 dB over 95-nm bandwidth for both polarizations. Furthermore, this simplified architecture eases cascading, allowing the demonstration of IL below 1.1 dB and ER larger than 24 dB over 85-nm wavelength range in a dual-stage configuration.

Grating couplers enable position-friendly interfacing of silicon chips by optical fibers. The conventional coupler designs call upon comparatively complex architectures to afford efficient light coupling to sub-micron silicon-on-insulator (SOI) waveguides. Conversely, the blazing effect in double-etched gratings provides high coupling efficiency with reduced fabrication intricacy. In this Letter, we demonstrate for the first time, to the best of our knowledge, the realization of an ultra-directional L-shaped grating coupler, seamlessly fabricated by using 193 nm deep-ultraviolet (deep-UV) lithography. We also include a subwavelength index engineered waveguide-to-grating transition that provides an eight-fold reduction of the grating reflectivity, down to 1% (-20 dB). A measured coupling efficiency of -2.7 dB (54%) is achieved, with a bandwidth of 62 nm. These results open promising prospects for the implementation of efficient, robust, and cost-effective coupling interfaces for sub-micrometric SOI waveguides, as desired for large-volume applications in silicon photonics.

International audience; We present on experimental results of straininduced Pockels effect in silicon based on Mach-Zehnder interferometer modulators. We theoretically studied both Pockels effect and carrier parasitic effect in silicon under an electric field. We demonstrated high speed Pockels-based optical modulation up to 25 GHz.

We present a novel suspended Si waveguide approach for hybrid near-infrared and mid-infrared operation. Large waveguide cross-sections allow mid-infrared propagation, while an original corrugation yields effective single-mode near-infrared operation. Exploiting this concept, we demonstrated Bragg filters with 4 nm bandwidth and 40 dB rejection.

Periodically patterning Si with a pitch small enough to suppress diffraction, we synthesize an effective photonic medium with refractive index between those of Si and the cladding material. This technique releases new degrees of freedom in engineering of light-matter interaction, chromatic dispersion and light propagation in Si photonic waveguides. We report our advances in the development of subwavelength engineered structures for on-chip photonics circuits, including Si membrane waveguides for sensing applications in the near- and mid-infrared, and high pump-rejection filters for quantum photonics.

Silicon photonics has generated a strong interest in recent years, mainly for optical communications and optical interconnects in CMOS circuits. The main motivations for silicon photonics are the reduction of photonic system costs and the increase of the number of functionalities on the same integrated chip by combining photonics and electronics, along with a strong reduction of power consumption. However, one of the constraints of silicon as an active photonic material is its vanishing second order optical susceptibility, the so called χ(2) , due to the centrosymmety of the silicon crystal. To overcome this limitation, strain has been used as a way to deform the crystal and destroy the centrosymmetry which inhibits χ(2). The paper presents the recent advances in the development of second-order nonlinearities including discussions from fundamental origin of Pockels effect in silicon until its implementation in a real device. Carrier effects induced by an electric field leading to an electro-optics behavior will also be discussed.

The large transparency window of silicon (1.1 - 8 μm wavelength range) makes it a promising material for the implementation of on-chip sensors operating over an ultra-wide wavelength range. However, the implementation of the silicon-on-insulator platform is restricted by the absorption of buried oxide layer for wavelengths above 4 μm. Here, we report our advances in development of silicon waveguides for broadband operation extending from near- to mid-infrared wavelengths. We present suspended silicon waveguides that exploit a novel periodic corrugation approach to circumvent the buried oxide absorption problem and provide effective single mode operation simultaneously for near- and mid-infrared wavelengths.

With the increasing demand of data, current chip-scale communication systems based on metallic interconnects suffer rate limitations and power consumptions. In this context, Silicon photonics has emerged as an alternative by replacing the classical copper interconnects with silicon waveguides while taking advantage of the well-established CMOS foundries techniques to reduce fabrication costs. Silicon is now considered as an excellent candidate for the development of integrated optical functionalities including waveguiding structures, modulators, switches… One of the main challenges of silicon photonics is to reduce the power consumption and the swing voltage of optical silicon modulators while increasing the data rate speed. However, silicon is a centrosymmetric crystal, vanishing the second order nonlinear effect i.e. Pockels effect which is intrinsically a high speed effect. To overcome this limitation, mechanical stresses on silicon to break the crystal symmetry can be used depositing a strained overlayer. In this work, we have studied the effect of the stress layer in the modulation characteristics based on Mach-Zehnder interferometers. The deposition of silicon nitride as the stress layer and its optimization to induce the maximum effect will be presented.

We report our advances in development of subwavelength engineered silicon photonic devices for near- and mid-infrared applications. By periodically patterning Si with a pitch small enough to suppress diffraction, we synthesize an effective photonic medium with refractive index between those of Si and the cladding material. This technique releases new degrees of freedom in engineering of light-matter interaction, chromatic dispersion and light propagation in Si photonic waveguides. We present an overview of our recent results in the realization of novel devices including filters and waveguides for near- and mid-infrared wavelength range.

Silicon photonics is being considered as the future photonic platform for low power consumption optical communications. However, silicon is a centrosymmetric crystal, i.e. silicon doesn’t have Pockels effect. Nevertheless, breaking the crystal symmetry of silicon can be used to overcome this limitation. This crystal modification is achieved by depositing a SiN high-stress overlayer. In this work, we present recent developments on the subject taking into account parasitic effects including plasma dispersion effect and fixed charge effect under an electric field. We theoretically and experimentally investigated Pockels effect in silicon waveguides and last results will be presented.

International audience; A new Si/Ge/Si heterojunction based waveguide photodetector has been demonstrated in order to reduce the fabrication cost, increase the responsivity, and improve process robustness. State of the art characteristics in terms of dark current, responsivity and bandwidth have been obtained. Furthermore, such photodetectors were characterized in avalanche mode in order to improve the sensitivity and reduce the overall power consumption of the optical circuit

Controlling the group velocity dispersion of silicon nanophotonic waveguides has been recognized as a key ingredient to enhance the development of various on-chip optical applications. However, the strong wavelength dependence of the dispersion in waveguides implemented on the high index contrast silicon-on-insulator (SOI) platform substantially hinders their wideband operation, which in turn, limits their deployment. In this work, we exploit the potential of non-resonant sub-wavelength grating (SWG) nanostructures to perform a flexible and wideband control of dispersion in SOI waveguides. In particular, we demonstrated that the overall dispersion of the SWG-engineered metamaterial waveguides can be tailored across the transparency window of the SOI platform, keeping easy-to-handle single-etch step manufacturing. The SWG silicon waveguides overcladded by silicon nitride exhibit significant reduction of wavelength dependence of dispersion, yet providing intriguing and customizable synthesis of various attractive dispersion profiles. These include large normal up to low anomalous operation regimes, both of which could make a great promise for plethora of emerging applications in silicon photonics.

This tutorial will cover the principles, design, fabrication and applications of subwavelength metamaterial structures in integrated optics, including a comprehensive overview of recent advances in implementations of these structures in silicon photonics.

We report our advances in development of subwavelength engineered structures for integrated photonics, specifically high-efficiency fiber-chip couplers, broadband surface grating couplers and ultra-broadband nanophotonic beam splitters.

A broad transparency range of its constituent materials and compatibility with standard fabrication processes make germanium-on-silicon (Ge-on-Si) an excellent platform for the realization of mid-infrared photonic circuits. However, the comparatively large Ge waveguide thickness and its moderate refractive index contrast with the Si substrate hinder the implementation of efficient fiber-chip grating couplers. We report for the first time, to the best of our knowledge, a single-etch Ge-on-Si grating coupler with an inversely tapered access stage, operating at a 3.8 μm wavelength. Optimized grating excitation yields a coupling efficiency of -11 dB (7.9%), the highest value reported for a mid-infrared Ge-on-Si grating coupler, with reflectivity below -15 dB (3.2%). The large periodicity of our higher-order grating design substantially relaxes the fabrication constraints. We also demonstrate that a focusing geometry allows a 10-fold reduction in inverse taper length, from 500 to 50 μm.

We report our advances in development of subwavelength engineered structures for integrated photonics. This unique technology allows synthesis of an effective photonic medium with an unprecedented control of material properties, constituting a powerful tool for a designer of photonic integrated circuits. By locally engineering the refractive index of silicon by forming a pattern of holes at the subwavelength scale it is possible to manipulate the flow of light in silicon photonic waveguides. We have demonstrated a number of subwavelength engineered devices operating at telecom wavelengths, including fiber-chip couplers, waveguide crossings, WDM multiplexers, ultra-fast optical switches, athermal waveguides, evanescent field sensors, polarization rotators, transceiver hybrids and colorless interference couplers. The subwavelength metamaterial concept has been adopted by industry (IBM) for fiber-chip coupling and subwavelength engineered structures are likely to become key building blocks for the next generation of integrated photonic circuits. We present an overview of different implementations of these structures in silicon photonic integrated circuits, such as high-efficiency fiber-chip couplers, wavelength multiplexers, microspectrometers, waveguide crossovers, ultra-broadband splitters and mid-infrared waveguide components, to name a few., 2016 Progress in Electromagnetic Research Symposium (PIERS), August 8-11, 2016, Shanghai, China

Subwavelength engineering in silicon photonic integrated circuits is a powerful design tool that allows one to synthesize an effective photonic medium with adjustable refractive index. This creates a new degree of freedom in photonic circuit design. We present an overview of the fundamental concept and its application to address several important practical challenges in the implementation of silicon photonics as a next generation photonics platform for telecom, datacom and sensing. In particular, we report our results in developing highly efficient and broadband fiber-chip couplers for silicon photonic wire waveguides using subwavelength engineered edge coupling structures. We experimentally demonstrate a coupling efficiency of -0.4 dB and polarization independent operation for a broad spectral range exceeding 100 nm for optical fiber with a core diameter of 3.2 μm. For coupling to standard SMF-28 fiber with 10.4 μm mode field diameter we numerically demonstrate a subwavelength engineered overlayer structure composed of SiO2 and Si3N4 which exhibits an overall coupling efficiency exceeding 90%. We have also used our subwavelength structure for coupling experiments with a conventional InGaAsP/InP buried heterostructure laser at λ = 1.3 μm with a measured near field mode size of 2.1 μm×2.8 μm. Peak coupling efficiency is 1.5 dB with 1-dB alignment tolerance of approximately ±1.2 μm horizontally and ±0.8 μm vertically. We further present subwavelength engineered grating couplers fabricated in a single-etch step for the telecom (1.55 μm) and datacom (1.3 μm) wavelengths with efficiencies exceeding -0.5 dB. Further applications that will be discussed include waveguide crossings, microspectrometers, ultra-fast optical switches, athermal waveguides, evanescent field sensors, polarization rotators and colorless interference couplers., 2016 Progress in Electromagnetic Research Symposium (PIERS), August 8-11, 2016, Shanghai, China

We report our recent advances in development of subwavelength engineered dielectric metamaterial structures for integrated photonics., 18th International Conference on Transparent Optical Networks (ICTON), July 10 -14, 2016, Trento, Italy

International audience; We report, for the first time, on the design and experimental demonstration of fiber-chip surface grating couplers based on subwavelength grating engineered nanostructure operating in the low fiber chromatic dispersion window (around 1.3 μm wavelengths), which is of great interest for short-reach data communication applications. Our coupler designs meet the minimum feature size requirements of large-volume deep-ultraviolet stepper lithography processes. The fiber-chip couplers are implemented in a standard 220-nm-thick silicon-on-insulator (SOI) platform and are fabricated by using a single etch process. Several types of couplers are presented, specifically the uniform, the apodized, and the focusing designs. The measured peak coupling efficiency is −2.5 dB (56%) near the central wavelength of 1.3 μm. In addition, by utilizing the technique of the backside substrate metallization underneath the grating couplers, the coupling efficiency of up to −0.5 dB (89%) is predicted by Finite Difference Time Domain (FDTD) calculations.

In this paper we present a review of passive and active photonic devices in three mid-IR silicon photonics material platforms: germanium on silicon, suspended silicon and silicon on insulator (SOI).

We present the first experimental demonstration of a new fiber-chip grating coupler concept that exploits the blazing effect by interleaving the standard full (220 nm) and shallow etch (70 nm) trenches in a 220 nm thick silicon layer. The high directionality is obtained by controlling the separation between the deep and shallow trenches to achieve constructive interference in the upward direction and destructive interference toward the silicon substrate. Utilizing this concept, the grating directionality can be maximized independent of the bottom oxide thickness. The coupler also includes a subwavelength-engineered index-matching region, designed to reduce the reflectivity at the interface between the injection waveguide and the grating. We report a measured fiber-chip coupling efficiency of −1.3 dB , the highest coupling efficiency achieved to date for a surface grating coupler in a 220 nm silicon-on-insulator platform fabricated in a conventional dual-etch process without high-index overlays or bottom mirrors.

Surface grating couplers are fundamental components in chip-based photonic devices to couple light between photonic integrated circuits and optical fibers. In this work, we report on a grating coupler with sub-decibel experimental coupling efficiency using a single etch process in a standard 220-nm silicon-on-insulator (SOI) platform. We specifically demonstrate a subwavelength metamaterial refractive index engineered nanostructure with backside metal reflector, with the measured peak fiber-chip coupling efficiency of -0.69 dB (85.3%) and 3 dB bandwidth of 60 nm. This is the highest coupling efficiency hitherto experimentally achieved for a surface grating coupler implemented in 220-nm SOI platform.

We present the first experimental demonstration of a new fiber-chip grating coupler concept that exploits the blazing effect by interleaving deep and shallow etch trenches to maximize directionality. The grating couplers were fabricated using both 193 nm deep-ultraviolet lithography and electron beam lithography. The measured peak fiber-chip coupling efficiency is -1.8 dB at a wavelength of 1550 nm, with a 3 dB bandwidth of 52 nm., 2015 IEEE 12th International Conference on Group IV Photonics (GFP), 2015-8-26 - 28, Vancouver, BC, Canada