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This article presents the use of flexible carbon substrates for the growth of III-nitride nanowire light emitters. A dense packing of gallium nitride nanowires were grown on a carbon paper substrate. The nanowires grew predominantly along the a-plane direction, normal to the local surface of the carbon paper. Strong photo- and electro-luminescence was observed from InGaN quantum well light emitting diode nanowires. (© 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [ABSTRACT FROM AUTHOR]

The family of III-V nitride semiconductors has garnered significant research attention over the last 20-25 years, and these efforts have led to many highly successful technologies, especially in the area of light emitting devices such as light emitting diodes for solid state white lighting and lasers for high density optical read/write memories. These applications have taken advantage of a key material property of the III-N materials, namely a direct, tunable (0.7-6.2 eV, λ ∼ 200 nm to 1.7 μm) bandgap and have been accomplished despite a relatively poor level of material quality. But a direct, tunable bandgap is only one of many interesting properties of III-N materials of interest to potential future technologies. A considerable list of first and second order properties make this family of semiconductors even more attractive-namely, electric polarization, piezoelectricity, high breakdown field, pyroelectricity, electro-optic and photo-elastic effects, etc. The first few of these have found much utility in the development of high power transistors that promise significant commercial success in both communications and power switching applications. As these areas begin to flourish, it is reasonable to begin to explore what might be next for this versatile family of semiconductors. Here are highlighted three areas of significant potential for future III-N research-atomic layer epitaxy of complex heterostructures, variable polarity homo- and hetero-structures of arbitrary geometries, and nanowire heterostructures. Early results, key technical challenges, and the ultimate potential for future technologies are highlighted for each research path. [ABSTRACT FROM AUTHOR]

Abstract: In this study, GaN LEDs grown with an intermediate DBR on a Si substrate were chemically etched by 3M KOH solution under UV light illumination. After 60min of KOH etching, the hexagonal etch pits and randomized embossments were clearly imaged by SEM and AFM. The etch pits were generated at the threading dislocations, which are common for lattice mismatched growth of GaN on Si. The photoluminescence intensity at 380nm was enhanced by approximately 21% after PEC etching. The enhanced PL intensity indicated that the generated etch pits and embossments increased the surface area, and effectively increased light scattering effects by randomizing the light rays and increasing the number of scattering events. [Copyright &y& Elsevier]

Abstract: A polariton-based light emitter is a extraordinary concept as an alternative to a light-emitting diode (LED) or laser diode. The physics of a polariton laser is fundamentally different from the spontaneous emission process of an LED or the inversion and stimulated emission process of a laser diode. The rapid decay and emission from this polariton–exciton state bypasses the normal irreversible spontaneous emission and associated non-radiative decay mechanisms. An AlGaN/AlN nucleation bilayer was employed on -plane sapphire to deposit non-polar GaN quantum wells embedded in an AlGaN-based cavity surrounded by top and bottom distributed Bragg reflectors (DBRs). The reflectance data show that the exciton and photon states can be tuned (by changing the angle of the sample) to the same energy. The characteristic strong coupling was observed in the reflectance data where the states of the exciton and photon do not overlap; rather they split into an upper polariton state and a lower polariton state. The photoluminescence (PL) showed a strong emission at a low stimulation level at a similar energy and angle. [Copyright &y& Elsevier]

Abstract: The flip-chip configuration is employed for the production of high-brightness GaN-based light emitting diodes to improve the extraction of heat. A lithographic approach based on a sacrificial SiO2 nanosphere etch mask was developed to enhance the external extraction of light from the sapphire substrate. Closed-packed arrays of SiO2 nanospheres were prepared by a simple solution-based method on the sapphire substrate. Subsequent dry-etching via inductively coupled plasma using a gas mixture of BCl3 and Cl2 transferred a pattern into the sapphire substrate with the lowest etching at the center of the SiO2 nanosphere. This process created an array of circular cones in the surface of the sapphire that were found to be effective in enhancing the light extraction efficiency through multi-photon scatterings. Room temperature photoluminescence exhibited an increase of 22.5% in intensity after the surface of sapphire was textured. [Copyright &y& Elsevier]

We report on the development of a large-area few-layer graphene (FLG)-based transparent conductive electrode as a current spreading layer for GaN-based ultraviolet (UV) light-emitting diodes (LEDs). Large-area FLG was deposited on Cu using the chemical vapor deposition (CVD) method and subsequently transferred to the surface of the UV LED. UV light at a peak of 372 nm was emitted through the FLG-based transparent conductive electrode. The current spreading effects of FLG were clearly evident in both the optical images of electroluminescence (EL) and current-voltage (I-V) characteristics. Degradation of the FLG-based transparent conductive electrode could be induced by high power operation. Our results indicate that a large-area FLG-based electrode on GaN offers excellent current spreading and ultra-violet transparency properties when compared to the standard optoelectronic indium tin oxide (ITO) contact layer. [ABSTRACT FROM AUTHOR]

We report that the oxidation of graphene-based highly transparent conductive layers to AlGaN/GaN/AlGaN ultra-violet (UV) light-emitting diodes (LEDs) was suppressed by the use of SiNX passivation layers. Although graphene is considered to be an ideal candidate as the transparent conductive layer to UV-LEDs, oxidation of these layers at high operating temperatures has been an issue. The oxidation is initiated at the un-saturated carbon atoms at the edges of the graphene and reduces the UV light intensity and degrades the current-voltage (I-V) characteristics. The oxidation also can occur at defects, including vacancies. However, GaN-based UV-LEDs deposited with SiNX by plasma-enhanced chemical vapor deposition showed minimal degradation of light output intensity and I-V characteristics because the graphene-based UV transparent conductive layers were shielded from the oxygen molecules. This is a simple and effective approach for maintaining the advantages of graphene conducting layers as electrodes on UV-LEDs. [ABSTRACT FROM AUTHOR]

Abstract: The surface of a non-polar a-plane GaN light-emitting diode (LED) was intentionally damaged with a KOH wet etch to enhance the extraction of light. This roughening technique has been commonly applied to c-plane polar GaN LEDs to extract photons that would otherwise suffer from total internal refraction. We show that wet etching of the non-polar LED does create a textured surface that increases the light extraction efficiency; however, the mechanism of the etch is quite dissimilar to the etch mechanism observed for c-plane LEDs. In fact, the etch proceeds perpendicular to the a-plane surface along unstable N-face (000−1) plane with the Ga-face plane resistant to the etch. The photoluminescence intensity from a-plane non-polar LED after KOH-based wet etching was increased by 83% in our experiments. Therefore, surface roughening by KOH-based wet etch was found to be very effective to extract photons from a-plane non-polar GaN-based LEDs. [Copyright &y& Elsevier]