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In this paper, a novel termination (“match”) scheme is introduced with absorbing material for high-frequency measurements. Through the absorption of electromagnetic waves, absorbing material makes an equivalent absorbing boundary condition at the interface, which creates an equivalent termination condition. The absorbing termination can be used to facilitate on-demand match condition in high-frequency measurements. The proposed technique is particularly useful when resistive termination is difficult to implement or too expensive to apply. For example, the soldering process (soldering-on soldering-off) is time-consuming, hard to control on the precise soldering position, and easy to break the printed circuit board soldering pads. It is useful for various applications, including via crosstalk measurements in socket, package breakout via array, or other dense/fine structures. The absorbing termination method provides an innovative termination solution for RF/microwave measurements. [ABSTRACT FROM PUBLISHER]

In this paper, bond via array (BVA) wirebond is used to achieve compact vertical integration and improve the electrical performance for system in package (SiP). Two techniques are presented. In the first technique, BVA wirebonds are utilized to integrate some passive or active components vertically onto other components. This significantly reduces the horizontal footprint of the entire SiP. In terms of electrical performance, this vertical integration provides much lower parasitic inductance than conventional 2-D horizontal integration design because of shorter interconnection. For example, the proposed technology can significantly reduce power delivery network impedance compared to a conventional design. In the second technique, we propose BVA wirebond wires as an electromagnetic interference (EMI) shield between different domains within SiP. This provides a lower cost solution for EMI shielding, particularly when regions within a package need to be shielded. [ABSTRACT FROM PUBLISHER]

A new technology is developed for the mitigation of stub effects in high-speed interconnects. This technology substantially reduces the stub effects for high-speed signaling. It dampens reflected signals on stubs, thus reducing intersymbol interference and harmful coupling, and correcting timing jitter, all typically induced by the stub’s reflected signals. This paper shows two applications for high-speed digital system designs, the mitigation of via stub effects and that of empty connector effects, respectively. However, it is notable that the present method is suitable for reflection suppression for arbitrary types of stubs to improve the signal integrity. [ABSTRACT FROM PUBLISHER]