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Traditional building envelopes have passive insulation systems that cannot respond to dynamic changes in the environment. An Active Insulation System (AIS) consists of Active Insulation Materials (AIMs) that dynamically vary the thermal conductivity of the insulation system. Several researchers have evaluated the impact of AIS on building thermal and energy performance by using simulation tools. Up to 70% savings in annual heating and cooling energy and significant reductions in peak demand have been predicted for some climates with wall systems employing AIS. However, materials and assembly development still need a cost-effective product that achieves the required performance. In this study, we present the process of developing an AIS that we will install in a test hut for its performance evaluation. Minimum performance criteria of the AIS system are developed based on R-low/R-high ratio, required time and efficiency to switch states, and cost estimates. The following steps during this study are creating the concept to meet the requirements, predicting the performance via simulations, developing the experimental setup for bench-scale testing, and finally, constructing a full-scale wall assembly and monitoring the performance when exposed to environmental chamber tests. The selected approach uses off-the-shelf products to create an AIS that can switch R-value between 0.98 ft2·°F·h/BTU (0.173 m2·K/W) and 5.81 ft2·°F·h/BTU (1.02 m2·K/W) and have a switching time of less than one minute between R-high and R-low. [ABSTRACT FROM AUTHOR]

• All-atom simulations of gas/polymer interfacial heat transport for the first time. • Find accommodation coefficients between gases and polymers can be well below 1. • New accommodation coefficients can significantly reduce gas thermal conductivity. • Conducted experiment and validated the NEMD simulations predictions. • Bridged the knowledge gap that is essential for thermal insulation applications. Determining the energy accommodation between gases and solids is essential to developing porous thermal insulation materials with ultra-low effective thermal conductivity that reduce energy use, greenhouse gas emissions, and fossil fuel consumption. The energy accommodation coefficients of most gases, however, have been rarely studied, especially with respect to solids that have relatively high thermal resistivity, e.g., polymers. In this work, by using all-atom nonequilibrium molecular dynamics simulations, we reveal the accommodation coefficients of He, Ar, N 2 , and O 2 with polymers, mainly polystyrene. We find that their values are around 0.51, 0.72, 0.79, and 0.90, respectively, suggesting a critical reexamination of the commonly used theoretical maximum value of 1. We have also conducted experiments and validated the value for air, which is about 0.81. Such a change in accommodation coefficients can lead to a reduction of about 70%, 50%, 35%, and 20% in the thermal conductivity of He, Ar, N 2 , and O 2 gases in nano pores (below 100 nm) or at low pressures (below 1 millibar). With these new accommodation coefficients, we find that in a 10 nm pore with ambient pressure at 300 K, the gas thermal conductivity of He, Ar, N 2 , and O 2 in porous polystyrene can be as low as 9.7 × 10−4, 3.4 × 10−4, 7.3 × 10−4, and 8.5 × 10−4 W·m−1·K−1, respectively, which are two to three orders of magnitude lower than their bulk values, promising higher thermal resistivity of insulation materials. This work reveals the fundamental energy exchange between gases and polymers, providing important guidance for designing high-performance thermal insulation materials for various applications. [ABSTRACT FROM AUTHOR]

In the past few decades, significant efforts have been made to improve the theoretical understanding of thermal transport mechanisms in thermal insulation materials and push the thermal conductivity's lower limits. However, most works focused singularly on specific types of materials, and the models used for thermal conductivity predictions are diverse - a model that fits one material might not fit others. Here, we improve and unify the gas and solid thermal conductivity models for porous materials. Through experimental characterization of several different materials as well as literature data for other materials, these models are validated. We have also found that the pressure-dependent gas thermal conductivity of most materials can be well fitted by using one or two pore sizes without using a complex pore size distribution. With the refined models, we decompose the effective thermal conductivity of several thermal insulation materials into gas, solid, and radiation contributions. For cellular (polystyrene and polyurethane) foams, the relative contributions from air, solid, and radiation are 58–75%, 3–11%, 16–38%, respectively. For granular porous materials (polyurethane and silica in this work), the contributions from air, solid, and radiation are 45–66%, 34–46%, and 0–8%, respectively. This work is expected to provide guidance on the design and optimization of the next generation of thermal insulation materials, for example, through the effort of reducing gas conduction and radiation in foams and suppressing gas and solid conduction in aerogels. • Improved gas and solid thermal conductivity models for porous media. • Measured pressure dependent thermal conductivity for various porous materials. • Validated the improved models against current and literature experimental data. • Decoupled solid, gas and radiative thermal conductivity for insulation materials. • Obtained best models for cellular and granular insulation materials. [ABSTRACT FROM AUTHOR]

We report a simple and commercially viable strategy to produce thermoplastic composite foams using synergistic foaming approaches – incorporating porous-shell hollow-interior glass spheres (PHGS) as a filler and utilizing expandable thermoplastic microspheres (EMS) as a physical blowing agent – for thermal insulation applications. The EMS in these composites ensure formation of highly porous, low-density foam while the PHGSs provide low thermal conductivity and lightweight mechanical reinforcement. Through systematic optimization of the PHGS and EMS loadings, a lightweight, and robust insulation with thermal resistivity greater than 27.7 m·K/W (R/in. > 4) is achieved. Notably, the fabricated foams also demonstrated comparable compressive strength than some commercial thermoplastic insulating materials. Through optimization of PHGS and EMS concentrations, results indicated similar thermal performance characteristics at varying foam densities, while higher loadings of both components lead to reduced insulation performance and weak mechanical stability of the foams. The results obtained, when coupled with the potential scalability and tailor ability of the overall process towards targeted insulation performance, not only endows competitiveness with current commercial thermoplastic insulating materials but also offers great promise for the development of unique thermoplastic composite foams for a variety of insulation systems. [Display omitted] • Dual foam formation strategy was implemented to fabricate thermoplastic foams with variable density. • Thermal performance and compressive strength of the foams are tailorable. • Properties are comparable to commercial thermoplastic insulations. • Fabrication protocols are based on scalable commercial practices. [ABSTRACT FROM AUTHOR]

Active insulation systems (AISs) refer to building envelopes with insulation materials that can change their thermal conductivity and are coupled with thermal mass to reduce building energy consumption and peak power. In this research, a novel optimal control approach is proposed to evaluate the maximum theoretical energy and cost-saving potential of AISs. A time-varying model predictive control (TV-MPC) controller was used to optimally select the AIS mode and simultaneously determine the operation of the heating, ventilation and air conditioning (HVAC) system so that the maximum saving potential of the entire system can be realized. To comprehensively evaluate the power shifting flexibility of AISs, two optimization objectives—minimizing weekly electric energy consumption and minimizing weekly electricity cost—were considered. The summer season simulation results show that under the first objective, more than 50% electric and thermal energy was saved when the upper boundary of the indoor air temperature was set to 25 °C. Under the second optimization objective, 38% of the cost was saved. It can be expected that the developed approach can be easily applied to multiple types of AISs with different mechanisms. [ABSTRACT FROM AUTHOR]

Thermal insulation materials are crucial to improve the energy performance of buildings and industrial applications. We report an approach to create hermetically vacuum-sealed silica-based hollow microspheres that can lower the thermal conductivity of closed-cell insulation materials. The wall structure of these hollow microspheres includes a reticulated network of pores or channels that extend through the thickness of the wall. When a thin layer of glass material is applied to the wall exterior, followed by a vacuum-assisted thermal treatment process, the coated microsphere surfaces display a highly dense conformal coverage and near-complete elimination of surface porosity. The sealing efficiency of these microspheres is verified by trapping argon within their cavities as well as through evacuating their hollow cores. Notably, incorporating the evacuated microspheres into a polymer matrix resulted in ∼27% enhancement in its thermal insulation performance and no notable loss of performance was observed following three months of exposure to ambient conditions. Thus, we believe that the present study offers a commercially viable strategy that opens the door to applications of such inorganic hollow particles in areas ranging from vacuum-based thermal insulation systems to catalysis, separation technologies, and medical fields. • Closed-cell insulation materials based on vacuum-sealed hollow glass microspheres are developed. • Monolithic glass coatings applied onto microspheres by a sonic activated magnetron sputtering. • Sealing efficiency of microspheres verified by trapping argon and evacuating their hollow cores. • Polyurethane loaded with evacuated microspheres demonstrate 27% enhanced thermal insulation. • No loss in thermal insulation performance after 3 months of storage. [ABSTRACT FROM AUTHOR]