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The angular resolution of electron backscatter diffraction (EBSD) measurements can be significantly improved using an analysis based on determination of small shifts in features from one pattern to the next using cross-correlation functions. Using pattern shift measurements at many regions of the pattern, errors in the best fit strain and rotation tensors can be reduced. The authors show that elements of the strain tensor and small misorientations can be measured to ±10 -4 and ±0.006° for rotations. We apply the technique to two quite different materials systems. First, we determine the elastic strain distribution near the interface in a cross-sectioned SiGe epilayer, Si substrate semiconductor heterostructure. The plane stress boundary conditions at the sample surface are used to separate every term in the strain tensor. Second, the applicability to structural materials is illustrated by determining the lattice curvature caused by dislocations within the plastic zone associated with the wake and tip of a fatigue crack in a Ni based superalloy. The lattice curvatures are used to calculate the geometrically necessary dislocation content in the plastic zone. © 2006 Institute of Materials, Minerals and Mining.

The advance in Electron Backscatter Diffraction known as High Resolution EBSD has permitted the strain tensor components and neighbour disorientation measurements to be mapped at resolutions better than 2 parts in 10000. Following earlier research into this technique which was focused on verifying the sensitivity and accuracy of the measurements, recent studies have involved investigations on semiconductor and metallic polycrystalline materials. In particular observations of localized regions where residual strains exceeded the macroscopic yield stress have been thoroughly investigated to eliminate experimental error as a possible explanation. No such cause was found. Strain measurements on polycrystalline steels in uniaxial tension and during thermal stress relieving thermal treatment have also been carried out. Maps of the strain distribution during elastic loading and early stages of plastic flow showed hot spots of high strain as in the static tests but overall the measured elastic strain was equal to the applied strain.

The established electron backscatter diffraction (EBSD) technique for obtaining crystallographic information in the SEM has been adapted to permit elastic strain measurement. Basically, the displacement of crystallographic features in an EBSD pattern, such as zone axes, which result from strain in a crystal, is determined by comparing those same features as they appear in a pattern from an unstrained region of the crystal. The comparison is made by cross-correlation of selected regions in the two patterns. Tests show that the sensitivity to displacement measurement is 1 part in 10 000, which translates to a strain sensitivity of 2 parts in 10 000. Eight components of the strain tensor are determined directly and the ninth is calculated using the fact that the free surface of the sample is traction-free. Examples discussed are taken from studies of a lenticular fracture in germanium, the strain distribution surrounding a carbide precipitate in a nickel base alloy and grain boundary studies in another nickel base alloy.

In this paper, we describe the use of electron back scatter diffraction (EBSD) to study strain variations in crystalline samples at the nanoscale. The analysis relies on cross correlation measurements of small shifts in the EBSD pattern measured at many points dispersed across the pattern. The method allows the full strain tensor, and lattice rotations to be obtained at a sensitivity of ∼10 -4. The method is applied to study variations of strains and rotations near the surface of 200 nm thick epitaxial layers of Si 0.85Ge 0.15 grown on a Si substrate patterned with rectangular and square mesa. Linescans across rectangular mesas show that strain relaxation and accompanying lattice rotations are restricted to the edges of wide mesas but that the relaxation extends across the entirety of mesas narrower than ∼6 μm. Two dimensional maps of the strain variation in a ∼3 μm wide square mesa are also presented. © 2008 Elsevier Ltd. All rights reserved.

Extended abstract of a paper presented at Microscopy and Microanalysis 2006 in Chicago, Illinois, USA, July 30 – August 3, 2006