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As with the development of heat exchangers, especially in the fields of energy and microelectronics, where the mini-channel used in heat exchanger operations is used, as increasing the efficiency of heat exchangers depends on transferring the largest amount of heat to and from the used band. To increase this transfer, obstacles must be used to improve heat transfer, as these barriers disturb the used fluid and increase heat transfer by convection. In this research paper, a mini-channel containing obstacles of variable thickness was used to study the extent of their effect on heat transfer and its strength to withstand the flow pressures in the mini-channel and prevent its deformation. The results proved that with the increase in the thickness of the obstacle, it increases its strength to withstand stresses but at the same time reduces its strength in convective heat transfer. The reason for this is that the increase in the thickness of the obstacle increases the area for heat transfer and thus increases the resistance and heat and prevents heat transfer significantly. [ABSTRACT FROM AUTHOR]