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True random number generators (TRNGs) play an important role in encryption systems. In this brief, a novel method of generating true random numbers on a field-programmable gate array (FPGA) is proposed based on the random jitter of a multi-stage feedback ring oscillator (MSFRO) as the entropy source. Based on the traditional ring oscillator, a multi-stage feedback structure is added to enlarge the range of clock jitter, and improve the frequency of clock sampling and the randomness of the entropy source. Different from the traditional clock sampling structure, we use the clock jitter signal generated by the MSFRO to sample the clock signal generated by the phase-locked loop (PLL) of the FPGA. The obtained output value is operated by XOR to reduce the deviation of the output value and improve its randomness. The TRNG is implemented in Xilinx Virtex-6 FPGA, which has low hardware resource consumption and high throughput. The entropy source classification, hardware resources and throughput are compared with those of existing TRNGs. The results showed that the proposed TRNG only consumed 24 LUTs and 2 DFFs. Compared with other TRNGs, this design has very low hardware resource consumption and its throughput is up to 290 Mbps. The random bit sequence generated by this TRNG passes the NIST SP800-22 test and the NIST SP800-90B test. [ABSTRACT FROM AUTHOR]

Due to the winding level of the thinned wafers and the surface roughness of silicon dies, the quality of through-silicon vias (TSVs) varies during the fabrication and bonding process. If one TSV exhibits a defect during its manufacturing process, the probability of multiple defects occurring in the TSVs neighboring the faulty TSV increases, i.e., the TSV defects tend to be clustered, which significantly reduces the yield of 3-D integrated circuit. To resolve the clustered TSV faults, router-based, ring-based, group-based, and cellular-based redundant TSV (RTSV) architectures were proposed. However, the repair rate is low and the hardware overhead as well as delay overhead is high. In this article, we propose a honeycomb-based RTSV architecture to utilize the area and delay more efficiently as well as to maintain high yield. The simulation results show that the proposed architecture has a 99.84% repair rate for uniform faults and an 81.42% repair rate for highly clustered faults. The proposed design achieves a 51.66% reduction of hardware overhead compared with the router-based design and a 20.69%, 46.93%, 34.17%, and 11.15% reduction of total delay compared with ring-based, router-based, group-based, and cellular-based methods, respectively. [ABSTRACT FROM AUTHOR]

In this brief, a cobweb-based redundant through-silicon-via (TSV) design is proposed with efficient hardware as well as high repair rate to repair clustered faulty TSVs (FTSVs). The experimental simulation results demonstrate that for highly clustered faults, the repair rate of the proposed RTSV method is 48.59% and 1.75% higher than that of the ring-based and router-based RTSV methods, respectively. Furthermore, the proposed design can achieve 63.93% and 16.34% hardware reductions compared with the router-based and the ring-based design, respectively. [ABSTRACT FROM AUTHOR]