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This paper will evaluate the surge current robustness of different devices in relation to the active short circuit (ASC). For the purposes of this study, a Si IGBT and its diode, two SiC MOSFETs with different voltage ratings, a SiC JFET, and three GaN HEMTs will be compared. For the GaN devices, a eMode, a dMode, and a cascode device are employed. With the exception of the Si diode, all devices exhibited a current saturation effect. This saturation will result in significant losses and, ultimately, a thermal defect. For all devices, a safe operating area (SOA) criterion is established. For the SiC and GaN devices, the saturation voltage can be employed to define the safe operating area (SOA) criterion. In this context, two on-state resistance models will be defined for these devices. One is solely temperature-dependent, while the other also considers current saturation. Consequently, the saturation voltage and the on-resistance model represent a straightforward methodology for evaluating the ASC robustness of the devices. For all devices, a recommendation for a loss model and SOA criterion will be provided. Finally, the surge current robustness of all devices is compared. The Si, SiC and GaN devices exhibit comparable high surge current robustness in the application, with the exception of the GaN eMode, which is susceptible to strong current saturation. [ABSTRACT FROM AUTHOR]

In this letter, we achieved significantly enhanced avalanche ruggedness and surge current capability in GaN junction barrier Schottky (JBS) diode for highly reliable power operation. Based on the selective Mg-ion implantation technology, the GaN JBS diode obtains superior electrostatic performances, including 830-V breakdown voltage, 150-mΩ specific on-state resistance, and 0.5-V turning on voltage. Meanwhile, zero reverse recovery behaviors are observed even under extreme switching conditions of 600 V/10 A. During the reliability evaluation in the inductive load circuits, crucial avalanche capability with avalanche breakdown voltage over 965 V, avalanche energy up to 57.8 mJ, and more than 10 000 repetitive avalanche breakdown events are demonstrated. Together with the surge current tolerance up to 65 A and surge energy of 6.0 J, a large safe-operation-area under both forward and reverse inductive spikes is realized for the GaN-based rectifier. [ABSTRACT FROM AUTHOR]

This letter reports the avalanche and surge current ruggedness of the industry's first 1.2-kV-class vertical GaN p-n diodes fabricated on 100-mm GaN substrates. The 1.2-kV vertical GaN p-n diodes with a 1.39-mm2 device area and an avalanche breakdown voltage of 1589 V show a critical avalanche energy density of 7.6 J/cm2 in unclamped inductive switching tests, as well as a critical surge current of 54 A and a critical surge energy density of 180 J/cm2 in 10-ms surge current tests. All these values are the highest reported in vertical GaN devices and comparable to those of commercial SiC p-n diodes and merged p-n Schottky diodes. These GaN p-n diodes show significantly smaller reverse recovery compared to SiC p-n diodes, revealing less conductivity modulation in n-GaN. The negative temperature coefficient of differential on-resistance and the anticlockwise surge I–V locus are believed to be due to the increased acceptor ionization in p-GaN and the decreased contact resistance at high temperatures. These results suggest a high ruggedness of GaN p-n junctions with small bipolar currents and fast switching capabilities. As the first electrothermal ruggedness data for industry's vertical GaN devices, these results provide key new insights for the development of vertical GaN devices as well as their application spaces. [ABSTRACT FROM AUTHOR]

4H-SiC Junction Barrier Schottky (JBS) diodes (1.2 and 3.5 kV) have been processed using the same technology with two different layouts. From 4 A and for the whole temperature range, the 3.5-kV diodes exhibit a bipolar conduction independent of the layout. However, the behavior of the 1.2-kV diodes depends on the design. At 500 V-300 °C, the leakage current is only 100 nA and 10 μA for the 3.5- and 1.2-kV diodes, respectively. The switch-off performances show a reverse peak current of only 50% of the nominal current at 300°C for all JBS diodes. The JBS diodes have a surge current capability of around 80 A, two times higher than the Schottky diodes. DC electrical stresses are performed during 50 h, and all the 1.2-kV diodes exhibit no bipolar degradation. Nevertheless, some slight bipolar degradation is observed in 3.5-ky JBS diodes. Electroluminescence measurements exhibit the expansion of stacking faults in 3.5-kV diodes unlike in 1.2-kV diodes. [ABSTRACT FROM AUTHOR]