1. Contact resistances of NiGeAu, PdGeTiPt, and TiPd ohmic contacts to GaAs and their temperature dependence from 4.2 to 350 K.
- Author
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Jones, K. A., Linfield, E. H., and Frost, J. E. F.
- Subjects
OHMIC contacts ,GALLIUM arsenide ,MOLECULAR beam epitaxy - Abstract
The specific contact resistance (rc) of NiGeAu and PdGeTiPt ohmic contacts to n-GaAs and TiPd and PdGeTiPt ohmic contacts to p+-GaAs were determined as a function of temperature between 4.2 and 350 K. The low rc obtained for some of the contacts at 4.2 K implies that much of the total contact resistance measured at 4.2 K in two-dimensional electron gas structures lies across the n–n heterojunction(s) in series with the metal semiconductor junction. Although NiGeAu contacts have a lower contact resistance to n-GaAs, PdGeTiPt contacts, which have much better edge definition, can be substituted for the NiGeAu when they are properly annealed. Also, contacts with low rc values at 4.2 K can be made to p+-GaAs using either TiPd or properly annealed PdGeTiPt contacts. The rc versus temperature curves for the TiPd and alloyed NiGeAu contacts fit the field emission model. The other contacts have a larger temperature dependence suggesting that tunneling occurs via thermionic field emission directly through the barrier or via defect states. © 1996 American Institute of Physics. [ABSTRACT FROM AUTHOR]
- Published
- 1996
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