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The electron-emission properties of relaxation-induced traps in InAs/GaAs quantum dots (QDs) are studied in detail using capacitance-voltage (C-V) profiling and bias-dependent deep-level transient spectroscopy. Strain relaxation is shown to induce a threading-dislocation-related trap in the top GaAs layer and a misfit-dislocation-related trap near the QD. The threading trap decreases its electron-emission energy from 0.63 to 0.36 eV from sample surface toward the QD, whereas the misfit trap gradually increases its electron-emission energy from 0.28 to 0.42 eV from near the QD toward the GaAs bottom layer, indicating that both traps near the QD have lower electron-emission energies. Hence, the emission-energy change is attributed to the related traps across the QD interface where a band offset exists. The C-V profiling at 300 K shows extended carrier depletion near the QD. As temperature is increased, an electron-emission peak emerges at the QD followed by a prominent peak, suggesting that the trap responsible for the prominent peak lies in energy below the QD electron ground state. From a simulation, this trap is identified to be the misfit trap located at the QD and at the observed emission energy below the GaAs conduction band. Based on the energy location of this trap, we deduce a possible mode of strain relaxation. [ABSTRACT FROM AUTHOR]

Strain relaxation in GaAs/In0.2Ga0.8As/GaAs structures is investigated by analyzing relaxation-induced traps. Strain relaxation is shown to cause carrier depletion by the induction of a 0.53 eV trap in the top GaAs layer, a 0.13 eV trap in the InGaAs layer, and a 0.33 eV trap in the neighboring lower GaAs layer. The 0.53 eV trap which exhibits a logarithmic function of transient capacitance is attributed to threading dislocations. The 0.33 eV trap exhibits an exponential transient capacitance, suggesting a GaAs point defect as its origin. Given its activation energy, it is assigned to the EL6 in GaAs, commonly considered to be Asi-VGa complexes. This trap and the 0.13 eV trap are regarded as the same, since their energy difference is comparable to the optically determined conduction-band offset. The spatial location of this trap correlates with that of misfit dislocations. Accordingly, the production of this trap is determined from the mechanism of strain relaxation. A likely mode of strain relaxation is deduced from the locations of these traps. [ABSTRACT FROM AUTHOR]

Presents information on a study which investigated the transition of carrier distribution from the strained to the relaxed state in InGaAs/GaAs quantum wells by measuring capacitance voltage and analyzing x-ray diffraction. Carrier distribution of the quantum wells; Correlation between the carrier distribution and critical thickness of InGaAs/GaAs quantum wells.

Describes vertical cavity surface emitting (VCSE) lasers of gallium arsenide (GaAs) active regions and In[sub0.1]Ga[sub0.9]As-GaAs active regions. Purpose of the silver mirror; Information on the room temperature spectral characteristics of the VSCE.

We have grown and characterized heteroepitaxial films of InP on GaAs. We demonstrate that by using flow-rate modulation epitaxy to grow the interface layer in a two-step process, we can improve the quality of heteroepitaxy films. The full widths at half maximum of the x-ray rocking curve and the 10 K photoluminescence spectrum for a 6.2-μm-thick InP/GaAs are 144 arcsec and 1.28 meV, respectively. [ABSTRACT FROM AUTHOR]

The GaAs sample under study is a n-low temperature-i-p structure grown by molecular beam epitaxy with a low-temperature (LT) layer grown at 300 °C and annealed at 620 °C for 1 h. Admittance measurements on this sample reveal a negative capacitance at low frequency. This work analyzes the origin of the negative capacitance and its corresponding frequency-dependent conductance by combining two current components: charging-discharging current and the inertial conducting current. Analysis results indicate that the activation energies and time constants of both current components closely resemble each other and should correspond to the same trap. Based on the results presented herein, we can conclude that the negative capacitance at low frequency provides evidence of a generation-recombination center with an activation energy of 0.77 eV in the LT layer. [ABSTRACT FROM AUTHOR]

We present electrical data to show that, after nitrogen implantation, GaAs films become resistive after high-temperature annealing. The activation energies of the resistance are determined to be 0.34, 0.59, and 0.71 eV after annealing at 500, 700, and 950 °C, respectively. The increase in the activation energy with increasing annealing temperature can be explained by the results of traps detected in deep-level transient spectroscopy, where two traps at 0.32 and 0.70 eV are observed in the samples after annealing. The intensity of the trap at 0.32 eV is found to reduce by annealing. By comparing to the result of the x-ray diffraction, we suspect that this trap is related to the lattice-expansion defects. The trap at 0.70 eV is observed only in samples annealed at high temperatures. Since this trap contributes to the high-resistive effect, we believe that it is associated with the nitrogen ions. © 2000 American Institute of Physics. [ABSTRACT FROM AUTHOR]