1. High‐Performance Magnetic Sensorics for Printable and Flexible Electronics
- Author
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Daniil Karnaushenko, Stefan Baunack, Dmitriy D. Karnaushenko, Denys Makarov, Oliver G. Schmidt, and Max Stöber
- Subjects
Flexibility (engineering) ,Fabrication ,Materials science ,business.industry ,Mechanical Engineering ,printable electronics ,flexible GMR sensors ,Nanotechnology ,flexible electronics ,7. Clean energy ,Communications ,Flexible electronics ,GMR multilayers ,Application areas ,Mechanics of Materials ,Printed electronics ,Radio-frequency identification ,printable magnetic sensorics ,General Materials Science ,Electronics ,business ,Diode - Abstract
Flexible electronics has emerged as a standalone field and matured over past decades.1–6 This alternative formulation of electronics offers the unique possibility to adjust the shape of devices at will after their fabrication. The flexibility provides vast advantages over conventional rigid electronics; flexible printed circuit (FPC) boards have become an industrial standard for consumer electronics and medical implants,7–10 where large area, extreme thinness, and compliance to curved surfaces are the key requirements for the functional passive and active elements. Flexible devices strongly benefited from the recent developments of organic6,11,12 as well as inorganic10,13,14 electronics, which are prepared using printing and/or thin film technologies. Being synergetically combined with either inkjet, screen, or dispenser printing approaches, flexible electronics has witnessed fascinating innovations in several application areas including displays,15 organic light-emitting diodes,16 various types of sensors,17–21 radio frequency identification tags,22–24 and organic solar cells.25
- Published
- 2014
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