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Sandwich structures with a soft core typically exhibit multiple deformation modes such as bending, twisting and compression when subjected to transverse loads. Compressive behavior of soft core significantly affects the structural response, which is usually neglected in conventional plate theories. Additionally, conventional plate theories do not take into account transverse shear stress continuity. In order to address this concern and precisely characterize the characteristics of arbitrary multilayer laminated structures, a novel electromechanical coupled finite element model is developed. This model is based on a compressible layerwise third-order shear deformation theory with a soft core. Notably, the proposed model theory requires only twelve degrees of freedom for each quadratic element node. The accuracy of the model is validated first. Afterwards, several numerical investigations are carried out for piezolaminated sandwich structures with different width-to-thickness ratios, reinforcement angle and skew angle. The results demonstrate the applicability of the current model in predicting the behavior of laminated sandwich plates. [ABSTRACT FROM AUTHOR]

A procedure is proposed to analyze the structural failure of a composite wind blade subjected to quasi-static loads. The structural failure of a wind blade under extreme wind loads which can be treated as quasi-static loads is an important issue to be tackled when assessing the reliability of a wind turbine. In the proposed structural failure analysis procedure, the geometrically nonlinear finite element (FE) method together with several phenomenological failure criteria is used to investigate the possible failure modes such as incipient buckling, interfacial debonding, and first-ply failure of the blade via an incremental loading approach. The failure loads and locations associated with the possible failure modes for a number of small wind blades with different structural configurations are determined to study the appropriateness of the failure criteria. Static tests of several small glass-fabric composite wind blades were conducted to validate the suitability of the proposed procedure. It has been shown that the experimentally and theoretically predicted failure processes of the wind blades are in good agreement. The applications of the proposed procedure are demonstrated by means of a numerical example in which the failure process of a wind blade under quasi-static wind loads is simulated. [ABSTRACT FROM AUTHOR]

Abstract: Even though recently published results indicated that residual strains of the epoxy molding compound (EMC) play a key role on the warpage values and shapes of the plastic ball grid array (PBGA) packages, it is still unknown about how these residual strains build up and change during the manufacturing and infrared (IR) solder reflow processes. The purpose of this study is to quantify the residual strains of the EMC in the PBGA packages during the aforementioned processes using a combination of experimental, theoretical and numerical approaches. In the experiments, a full-field shadow moiré is used for measuring their real-time out-of-plane deformation (warpage), during heating and cooling conditions, of two types of the PBGA specimens (without a silicon chip inside) with the same EMC but different substrates (with glass transition temperature T g =172 and 202°C). Furthermore, Timoshenko’s bi-material theory associated with the measured and temperature-dependent elastic moduli and coefficients of thermal expansion for the EMC and substrates is applied for extracting residual strains of the EMC from shadow moiré results. In the analysis, the finite element method cooperating with those determined residual strains is employed to numerically simulate the thermal-induced deformations of the PBGA specimens, in order to verify mechanics. The full-field warpage of the specimens from shadow moiré is documented before and after post-mold curing, solder reflow and during the temperature cycling (from room temperature to 260°C). The residual strains of the EMC for the specimens with low-T g and high-T g substrates after post-mold curing are found to be 0.059% and 0.134%, respectively, which double those before post-mold curing, and further down to 0.035% and 0.08% after the first thermal cycling. After the first cycling, the residual strains remain almost constant during heating and cooling processes. This phenomenon is also observed at lead-free solder reflow processes. Therefore, the residual strains of the EMC induced by the chemical shrinkage of the EMC curing and possibly mold flow pressure are different between the specimens with low-T g and high-T g substrates, and these residual strains could change during post-mold curing and the first solder reflow processes. [Copyright &y& Elsevier]