Search

Abstract: In this work the influence of Selective Epitaxial Growth (SEG), high-k gate-dielectric and rotation of the channel on the low frequency (LF)-noise is investigated. The carrier number fluctuations dominate the 1/f noise for all the devices studied. An unusual effective trap density profile is found. It decays with a larger distance from the interface. This implies a higher trap density in the interfacial SiO2-layer, compared with the high-k dielectric. The shape of the profile is different for a HfSiON gate-dielectric compared with a HfO2 gate-dielectric. Higher trap densities are found for the latter. The Selective Epitaxial Growth (SEG) and channel orientation show only a negligible impact on the noise behavior when a HfSiON-dielectric is used. [Copyright &y& Elsevier]

The low-frequency noise of triple-gate fin field-effect transistors (finFETs) fabricated on silicon-on-insulator (SOI) substrates, with HfO2 or HfSiON gate stacks has been studied. In most cases, 1/fγ noise has been observed with γ<1 for low frequencies f. It is shown that this type of noise can be ascribed to number fluctuations and scales with the effective device area. Based on a simple tunneling model, the noise spectral density has been converted to an oxide trap density profile, exhibiting a decay in Not for larger distances from the Si–SiO2 interface. This stands in contrast with planar bulk devices with a similar high-k gate stack and seems to be typical for the fin processing used, irrespective of further process details, like the use of selective epitaxial growth, strained SOI or strain-inducing cap layers. [ABSTRACT FROM AUTHOR]

Abstract: The impact of strain-engineering on the low frequency of n-channel tri-gate FinFETs fabricated on silicon on insulator (SOI) substrates noise is reported. The work is first focused on the study of nFinFETs with a standard structure and with strain-engineered channel structures, using either global or local straining techniques, or a combination of both. A carrier number fluctuation dominant flicker noise has been observed for all devices. Whereas no clear correlation between the applied strain techniques and the 1/f noise level has been found, an unusual noise spectral density was observed for the devices with selective epitaxial grown (SEG) source and drain regions. This unusual noise behaviour has been investigated for different fin widths (0.15μm up to 3μm) and different temperature conditions (150K up to 300K). An empirical model is proposed in order to explain this unusual noise behaviour. Moreover, two Lorentzians attributed to defects in the depletion region of the silicon fin were observed, and energy level and cross-section of these defects were estimated. [Copyright &y& Elsevier]