1. An Ultra-Thin Flexible CMOS Stress Sensor Demonstrated on an Adaptive Robotic Gripper
- Author
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Yigit Mahsereci, Stefan Saller, Harald Richter, and Joachim N. Burghartz
- Subjects
Signal processing ,Engineering ,business.industry ,020208 electrical & electronic engineering ,010401 analytical chemistry ,ComputingMethodologies_IMAGEPROCESSINGANDCOMPUTERVISION ,Successive approximation ADC ,02 engineering and technology ,Chip ,01 natural sciences ,Signal ,0104 chemical sciences ,Stress (mechanics) ,CMOS ,Integrator ,0202 electrical engineering, electronic engineering, information engineering ,Electronic engineering ,Shear stress ,Electrical and Electronic Engineering ,business - Abstract
An ultra-thin ( $20\;\bm{\upmu} {\bf m}$ ), flexible CMOS stress sensor for hybrid systems-in-foil (HySiF) is presented. The system is designed for Fin Ray® grippers in order to measure the emerging stress on the gripper in operation, enabling the extraction of object shape and operation status. In-plane stress is linearly converted to electrical signals proportional to shear stress and normal stress difference using two sensing elements. Each stress signal is processed and digitized by an integrator and a 10-bit SAR ADC. In contrast to rigid chips, the stress cannot be avoided in the sensitive blocks, such as the signal processing chain and digital controller, when an ultra-thin chip is under deformation. The influence of stress levels, up to 350 MPa, is minimized by using stress-insensitive components, design measures, and layout techniques. This work represents the first demonstration of stress-aware top-to-bottom CMOS design on an ultra-thin chip.
- Published
- 2016
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