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In this paper, we propose a design method that the crosstalk of probe connector pins satisfy the limitation of -30 dB. The parameters(inductance and capacitance) were extracted in the grid-structured probe connector pin system, and it is shown that the new parameters are easily calculated with increasing ground pin numbers using the previously calculated parameters. In addition, the crosstalk reduction algorithm by employing more grounds around the signal pin has been suggested, and it is confirmed that the suggested method is quite effective especially for the reduction of inductive couplings. Finally, we suggested the correlation between the pitch and the length of the pins to satisfy the crosstalk limitation of -30 dB with the given number of ground pins, which will be quite useful when design a probe connector pin system.

PCB traces in backplane are typically routed as striplines, which create near end crosstalk, but theoretically, no far end crosstalk. However, in practice, both near end and far end crosstalk introduced by via antipads and layer misalignment in the connector pin field due to manufacturing process variations can be significant. This paper presents an analysis for the first time of the PCB trace crosstalk in the connector pin field of high speed backplanes. Crosstalk from the adjacent differential pairs on the same layer and in particular, from neighboring layers is first modeled and simulated with the consideration of PCB design tolerances and routing constraints in the connector pin field. The model is then correlated with a 10ps edge TDR measurement. Finally, the simulated and measured results are provided to demonstrate the significance of the crosstalk due to connector pin field traces.

Over the past few years card connectors have progressed significantly from the 0.100" pitch gold tabs of the first PC's. New developments in card technology are driving higher connector pin count and denser, more unique connector packaging. Since more and more circuits must go from card to card, the card edge connectors have migrated to surface mount and are now straddling the card in order to achieve this higher number of required interconnections. A straddle mount connector system is evaluated in an electronic card assembly test facility for both material and process impacts. Emphasis is placed on the connector and associated process materials used. The contact integrity after successful solder attach has been evaluated. While in-depth details of the attach and subsequent repair process have been reported previously, the critical process parameters will be highlighted in this paper.

The General Purpose Work Station (GPWS) is a laboratory multiuse facility, as demonstrated during the Spacelab Life Sciences 1 (SLS-1) flight. The unit provided particulate containment under varying conditions, served as an effective work space for manipulating live animals, e.g., rats, served as a containment facility for fixatives, and was proposed for use to conduct in-flight maintenance during connector pin repair. The cabinet has a front door large enough to allow installation of a full-size microscope in-flight and is outfitted with a side window to allow delivery of items into the cabinet without exposure to the spacelab atmosphere. Additional support subsystems include inside cabinet mounting, surgical glove fine manipulations capability, and ac or dc power supply for experiment equipment, as will be demonstrated during Spacelab J. The GPWS, integrated and maintained in a double flight-rack, interfaces to spacelab systems including water cooling, avionics and cabin air, and power. Verification has been completed for multiple spacelab scenarios including SLS-2, SL-J, and SLS-3.

Before accepting percussive arc welding as a production process for making electrical interconnections, it was necessary to determine the effects of the main variables (materials, equipment, and operators) which are certain to be encountered in production. This report deals with a study made to develop the required information. The variables selected for study were materials (wire lots and connector pin lots), operators, and welding machines, each variable at two levels. Two different wire types were investigated. Statistically designed experiments were performed to determine the effects of these variables upon flexing strength, tensile strength, and electrical resistance. In general, significant effects were found for wire lots, operators, and welding machines (usually as interactions.) Although these effects are significant, the magnitude of the change does not appear to be excessive in terms of mean values. These results show that the process is controllable and that initial process standards can be calculated from the data presented.

The disclosure is directed to process and apparatus for the removal, site preparation, and replacement of any single connector pin contained within a sizeable array of closely spaced very small connector pins on an electronic packaging structure (substrate or module) without causing deleterious metallurgical effects either to the remaining pins or the ceramic substrate.