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• Heat conduction enhanced flexible phase change material (FPCM) film is developed. • FPCM film thermally manages the compact electronics almost without occupying space. • FPCM film lowers the chip's temperature with a maximum drop of 14.3 ℃. • Graphene film enhances heat transfer of FPCM film along the inplane direction. • Latent heat capacity utilization rate of the FPCM film is significantly increased. Strict internal space limit of compact electronics makes it hard to use cooling tubes for the forced convection or phase change materials (PCMs) block to thermal control. In this paper, two types of high thermal conductive flexible phase change material (FPCM) with latent heat of 160.2 J/g and 153.1 J/g were developed into film morphology with the thickness of 0.4 mm, and were used to manage heat dissipation of the compact electronics. The experimental results show that temperature of the analog chip controlled by FPCM film is indeed lowered with a maximum drop of 14.3 ℃. The promotion of FPCM's thermal conductivity increases the effective thermal control time but still is insufficient to the heat dissipation along the inplane direction inside electronics. Therefore, the graphene film with plane thermal conductivity of 1500 W/m·K is employed to fabricate the composite heat-diffusion FPCM film to enhance transverse heat transfer. The result shows the latent heat capacity utilization rate of the FPCM film and heat diffusion area along the inplane direction are significantly increased with the extension of thermal control time by 32.4% at 3.2 W. These results are expected to provide a strong basis for the implementation and optimization of phase change thermal management technique in compact electronic device. [ABSTRACT FROM AUTHOR]