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A 400 Gbps backplane switch was developed with low-cost, small-size, 8-channels 10 Gbps/port optical I/O and a SiGe Bi-CMOS switch LSI on a 60x60-mm 2 BGA package. It indicates the applicability of backplane switch for high throughput backplane interconnections.

Summary form only given. In conclusion, a low crosstalk 8-channel optical transceiver was developed for star topology access networks for the first time. A receiver dynamic range of 21.6 dB and an allowable interchannel receiving power difference of 16.6 dB, both large enough for fiber in the loop (FITL) system with a serving area of 7.2 km, were obtained at 155 Mbit/s.

A 400 Gbit/s backplane switch was developed with a low-cost, small-size, 8-channel 10 Gbit/s/port optical I/O and a SiGe Bi-CMOS switch LSI on a 60/spl times/60-mm-square BGA package. It indicates the applicability of OIP for high throughput backplane interconnections.

A novel opto-electronic hybrid integration platform using a flexible resin interposer on a silicon substrate has achieved low-cost, compact-size optical sub-assemblies. A 10 km error-free-transmission has been demonstrated with the optical sub-assemblies for 10-Gigabit Ethernet transceivers.

Eight-channel 1-Gbit/s array optical transmitter and receiver modules with 1.3-/spl mu/m wavelength have been developed using a passive-alignment assembly technology and one-chip transmitter and receiver LSIs, to achieve short-haul optical fiber interconnection cost effectively. It features a large dynamic range receiver that can tolerate the power fluctuation in low-cost adjustment-free transmitters and the loss deviation in cascaded optical connectors.

This paper describes a 3.125 Gbps 4-channel parallel optical transmitter and a receiver module with MT-RJ receptacle designed for a very short reach OC-192 interface between a DWDM transponder and a core router. The discussion is addressed on the following key features: (1) 4-channel 1310 nm FP-LDs with their anodes and cathodes separated channel-by-channel, (2) 4-channel passive optical alignment technology, (3) inter-channel crosstalk reduction technology in a Si optical bench, (4) low power consumption high speed LD driver and receiver LSIs. The applicability of newly developed 3.125 Gbps/ch 4-channel parallel optical transmitter and receiver module to very short reach application has also been demonstrated through a transmission experiment over a 500 m length of GI-50 MMF (graded-index multi mode fiber).

An optical interface is expected to solve the problems the electrical counterpart has. However, the conventional optical interface system using optical transceiver modules separately located from LSI packages on a printed circuit board (PCB), electrical interfaces among optical transceivers and LSI packages would limit interconnection speed. In addition, the electrical interface consumes a lot of power to drive the I/O buffers and signal lines on the PCB. To solve these problems, we have proposed a packaging technology to which OIP (Optical-interconnection as Intellectual Property) concept is applied. We developed a 3.125-Gbit/s/port crosspoint switch with 16 optical I/O ports on a 35x35-mm BGA package. It incorporates four small optical I/O modules called PETIT (Photonic/Electronic Tied InTerface).The PETIT consists of a 4-channel VCSEL array, a 4-channel pin-PD array, and a GaAs trans-impedance amplifier on an 8x8-mm ceramic substrate, and a newly developed optical connector interface is attached on the substrate. The sensitivity is 11.9 dBm under 12.5-Gbit/s full-duplex operation of the PETIT.