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In this paper, bond via array (BVA) wirebond is used to achieve compact vertical integration and improve the electrical performance for system in package (SiP). Two techniques are presented. In the first technique, BVA wirebonds are utilized to integrate some passive or active components vertically onto other components. This significantly reduces the horizontal footprint of the entire SiP. In terms of electrical performance, this vertical integration provides much lower parasitic inductance than conventional 2-D horizontal integration design because of shorter interconnection. For example, the proposed technology can significantly reduce power delivery network impedance compared to a conventional design. In the second technique, we propose BVA wirebond wires as an electromagnetic interference (EMI) shield between different domains within SiP. This provides a lower cost solution for EMI shielding, particularly when regions within a package need to be shielded. [ABSTRACT FROM PUBLISHER]

In this paper, we apply the broadband Green's function with low wavenumber extraction (BBGFL) to fast modeling of the radiated emissions from printed circuit boards (PCBs). We study power bus structures for electromagnetic interference/compatibility (EMI/EMC). We use the BBGFL to compute the Green's function over broadband frequencies along the boundary walls of arbitrarily shaped power/ground planes. The broadband Green's function is calculated by using modal expansions and low wavenumber extraction. Because the modal expressions are independent of frequencies, they are computed once and used for all frequencies. The radiated fields are derived from the equivalent magnetic surface currents on boundary walls using Huygen's equivalent principle. Results are illustrated up to 10 GHz and for arbitrary shaped PCB up to 5 inches in size. The accuracy and computational efficiency of the present method are compared with the method of moments (MoM) and the commercial tool HFSS. The BBGFL results are in good agreement with MoM and HFSS. The BBGFL is several hundred times faster than MoM and HFSS for broadband simulations. The significant improvement in computational efficiency makes this technique useful for electronic design automation to EMI/EMC applications. [ABSTRACT FROM PUBLISHER]

In this paper, we propose and investigate two novel applications of absorbing materials to suppress high-frequency couplings in high-speed interconnects. In the first application, absorbing materials are added to connector housing to reduce the noises caused by crosstalk and resonances. In the second application, a low-emission inductor is proposed by applying absorbing materials surrounding the body of an inductor. Full-wave simulations and measurements are performed to verify the proposed techniques. Results show absorbing materials significantly improve the performance of signal/power integrity and greatly reduce electromagnetic interference for high-speed digital system designs. [ABSTRACT FROM PUBLISHER]