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For development and integration of Si nanowires into nanoelectronic devices, an understanding of Ni silicide formation in electrical contacts to Si nanowires is necessary. Here, we examine the kinetics of Ni silicide phase formation. For Si nanowires with [111] growth directions, NiSi2 is the only phase to form in the temperature range 400–550 °C, and the NiSi2 growth exhibits linear kinetics from 400 to 500 °C with an activation energy of 0.76 ± 0.10 eV. In the case of Si nanowires with [112] growth directions, growth of the θ-Ni2Si phase in contact with the Si nanowire occurs with parabolic kinetics over the temperature range 400–550 °C, and an activation energy of 1.45 ± 0.07 eV/atom is extracted. Differences in the growth rates for Ni silicide phases with different SiNW growth directions implies that for simultaneous preparation of SiNW devices with Ni silicide contacts, SiNWs with the same growth direction are necessary.

Nickel germanide contacts are expected to play an important role in Ge-based electronics similar to that of their nickel silicide counterparts in Si devices. Here we have studied the solid state reaction between Ni contact pads and Ge nanowires. We observe the formation of axial nickel germanide segments after annealing at temperatures as low as 300 °C for 2 min. The nickel germanide segments are polycrystalline, without an epitaxial relationship to the Ge nanowire, in contrast to observations of epitaxial nickel silicide formation from Si nanowires. The crystal structure of the nickel germanide phase is consistent with the Ni2In prototype structure. Annealing above 400 °C results in fracture in the nickel germanide segment; however, nickel germanide segments as long as 1.7 μm can be formed by annealing at 400 °C for 5 min.