41 results on '"Fengjuan Wang"'
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2. Miniature and Symmetrical Transformer Based on Through-Silicon Vias
3. A Miniaturized Wideband Interdigital Bandpass Filter With High Out-Band Suppression Based on TSV Technology for W-Band Application
4. A Miniatured Passive Low-Pass Filter With Ultrawide Stopband Based on 3-D Integration Technology
5. Carbon awareness oriented data center location and configuration: An integrated optimization method
6. TSV-based SIW bandpass filter with adjustable transmission zeros for D-band applications
7. Miniaturized SIW Bandpass Filter Based on TSV Technology for THz Applications
8. Industrial decarbonisation oriented distributed renewable generation towards wastewater treatment sector: Case from the Yangtze River Delta region in China
9. A dynamic dissemination model for recurring online public opinion
10. Hybrid dynamic coal blending method to address multiple environmental objectives under a carbon emissions allocation mechanism
11. TSV-based SIW bandpass filter for W-band mobile communication applications
12. Simulation study of a cylindrical battery module
13. Bias twisting in side-tapered PMF Sagnac loop interferometer for simultaneous measurement of directional torsion and temperature
14. Effectiveness of thermal redistribution layer in cooling of <scp>3D ICs</scp>
15. Wideband transmission optimization for heterogenous interconnection in 3D IC
16. A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line
17. Equilibrium strategy-based economic-reliable approach for day-ahead scheduling towards solar-wind-gas hybrid power generation system: A case study from China
18. Analytical models of AC inductance and quality factor for TSV-based inductor
19. TSV-based hairpin bandpass filter for 6G mobile communication applications
20. An Effective Approach of Improving Electrical and Thermo-Mechanical Reliabilities of Through-Silicon Vias
21. An Ultracompact Butterworth Low-Pass Filter Based on Coaxial Through-Silicon Vias
22. Fiber Ring Laser Directional Torsion Sensor with Ultra-Wide Linear Response
23. Optimal design and operation of hybrid renewable energy system for drinking water treatment
24. Fabrication and measurement of 3D LPF based on coaxial TSV
25. An Effective Approach of Reducing the Keep-Out-Zone Induced by Coaxial Through-Silicon-Via
26. Analytical Model for Parasitic Capacitance of Tapered Through-silicon-vias with MOS Effect
27. A high-pass filter based on through-silicon via (TSV)
28. Investigation on impact of substrate on low-pass filter based on coaxial TSV
29. Highly efficient InGaN-LD-pumped bulk Pr:YLF orange laser at 607nm
30. Continuous-Wave Laser Emission of Pr:${\rm LiYF}_{4}$ at 695.8 nm
31. A novel guard method of through-silicon-via (TSV)
32. Simple and accurate inductance model of 3D inductor based on TSV
33. Equivalent circuit model of through-silicon-via in slow wave mode
34. Explicit model of thermal stress induced by annular through-silicon-via (TSV)
35. Thermal management of coaxial through-silicon-via (C-TSV)-based three-dimensional integrated circuit (3D IC)
36. Study on thermal stress and keep-out zone induced by Cu and SiO2 filled coaxial-annular through-silicon via
37. Effects of coaxial through-silicon via on carrier mobility along [100] and [110] crystal directions of (100) silicon
38. Continuous-Wave Ultraviolet Generation at 349 nm by Intracavity Frequency Doubling of a Diode-Pumped <formula formulatype='inline'><tex Notation='TeX'>$\hbox{Pr:LiYF}_{4}$</tex></formula> Laser
39. Thermo-mechanical performance of Cu and SiO2 filled coaxial through-silicon-via (TSV)
40. Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV)
41. Reduction of signal reflection in high-frequency three-dimensional (3D) integration circuits
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