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41 results on '"Fengjuan Wang"'

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4. A Miniatured Passive Low-Pass Filter With Ultrawide Stopband Based on 3-D Integration Technology

7. Miniaturized SIW Bandpass Filter Based on TSV Technology for THz Applications

9. A dynamic dissemination model for recurring online public opinion

13. Bias twisting in side-tapered PMF Sagnac loop interferometer for simultaneous measurement of directional torsion and temperature

17. Equilibrium strategy-based economic-reliable approach for day-ahead scheduling towards solar-wind-gas hybrid power generation system: A case study from China

19. TSV-based hairpin bandpass filter for 6G mobile communication applications

20. An Effective Approach of Improving Electrical and Thermo-Mechanical Reliabilities of Through-Silicon Vias

21. An Ultracompact Butterworth Low-Pass Filter Based on Coaxial Through-Silicon Vias

22. Fiber Ring Laser Directional Torsion Sensor with Ultra-Wide Linear Response

23. Optimal design and operation of hybrid renewable energy system for drinking water treatment

24. Fabrication and measurement of 3D LPF based on coaxial TSV

25. An Effective Approach of Reducing the Keep-Out-Zone Induced by Coaxial Through-Silicon-Via

27. A high-pass filter based on through-silicon via (TSV)

29. Highly efficient InGaN-LD-pumped bulk Pr:YLF orange laser at 607nm

30. Continuous-Wave Laser Emission of Pr:${\rm LiYF}_{4}$ at 695.8 nm

31. A novel guard method of through-silicon-via (TSV)

32. Simple and accurate inductance model of 3D inductor based on TSV

33. Equivalent circuit model of through-silicon-via in slow wave mode

34. Explicit model of thermal stress induced by annular through-silicon-via (TSV)

35. Thermal management of coaxial through-silicon-via (C-TSV)-based three-dimensional integrated circuit (3D IC)

37. Effects of coaxial through-silicon via on carrier mobility along [100] and [110] crystal directions of (100) silicon

38. Continuous-Wave Ultraviolet Generation at 349 nm by Intracavity Frequency Doubling of a Diode-Pumped <formula formulatype='inline'><tex Notation='TeX'>$\hbox{Pr:LiYF}_{4}$</tex></formula> Laser

40. Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV)

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