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1. Package solution of indirectly-heated type thermoelectric power sensors for RF application.

Author

Wang, D.B. and Liao, X.P.

Subjects
*ELECTRONIC packaging, *THERMOELECTRIC materials, *DETECTORS, *RADIO frequency, *ELECTRIC potential, *SENSITIVITY analysis
Abstract

An economical package solution of indirectly-heated type thermoelectric power sensors is proposed for RF application at X-band (8-12GHz). The measured results of output voltages show that they both have an excellent linearity before and after the package. The difference of the sensitivity at 10GHz is 0.02mV/mW. After the package, this power sensor will be conveniently embedded into the RF systems. [ABSTRACT FROM AUTHOR]

Published
2012
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