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Presents information on a study which examined the surface impedance of bulk and thick film granular high temperature superconductors. Analysis of the weakly coupled grain model; Methodology of the study; Results and discussion.

Dispersion in periodic microstrip transmission lines was investigated by using S-parameters to calculate the characteristic impedance and the complex propagation constant. Dispersion curves determined from a variety of methods, including simulation with IE3D and measurement with a network analyzer, were compared with an analytic transcendental model providing self-consistent validation of each method. Simulated S-parameters agreed with measurement, including the case of a multi-layered substrate. Very similar dispersion curves were produced using simulated S-parameters, simulated current distributions, analytic calculation and measured S-parameters. © 2009 Wiley Periodicals, Inc. Microwave Opt Technol Lett 51: 1010–1013, 2009; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.24268 [ABSTRACT FROM AUTHOR]