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In this paper, we employed molecular dynamics (MD) simulations to model the nanoindentation process, aiming to explore the mechanical characteristics of a silver (Ag) coating film on a copper (Cu) substrate. Three distinct bilayer configurations were selected, namely Ag (100)/Cu (111), Ag (110)/Cu (111), and Ag (111)/Cu (111), with the purpose of examining the impact of heterogeneous interfaces on deformation behaviors during nanoindentation. The results demonstrate that the Ag (111)/Cu (111) bilayer exhibits a higher force during the nanoindentation process when compared to the Ag (100)/Cu (111) and Ag (110)/Cu (111) bilayers. This suggests that interfaces with a smaller mismatch in the specified crystal plane between Ag and Cu are proven to be harder. To studied the correlation between indentation velocity and the interface, we considered various values of indentation velocities ranging from 120 m/s to 200 m/s, conducting indentations on the Ag (111)/Cu (111) bilayer. The findings indicate that variations in indentation velocity significantly impact the mechanical properties of Ag (111)/Cu (111) bilayers. Both force and hardness values exhibit a significant increase as indentation velocity rises, implying that the strength of Ag/Cu bilayers is more pronounced at higher indentation velocities. These observed trends were attributed to defect and dislocation formation at the interface, as confirmed through dislocation extraction analysis (DXA). [ABSTRACT FROM AUTHOR]