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We have been carrying out the FLAGSHIP 2020 Project to develop the Japanese next-generation flagship supercomputer, the Post-K, recently named “Fugaku”. We have designed an original many core processor based on Armv8 instruction sets with the Scalable Vector Extension (SVE), an A64FX processor, as well as a system including interconnect and a storage subsystem with the industry partner, Fujitsu. The “co-design” of the system and applications is a key to making it power efficient and high performance. We determined many architectural parameters by reflecting an analysis of a set of target applications provided by applications teams. In this paper, we present the pragmatic practice of our co-design effort for “Fugaku”. As a result, the system has been proven to be a very power-efficient system, and it is confirmed that the performance of some target applications using the whole system is more than 100 times the performance of the K computer.

Recently, increasing power usage of HPC systems is a critical issue. Therefore, effective power saving method for eliminating electricity waste are very important to develop.

In this paper, we introduce a new and highly scalable interconnect called Tofu interconnect D that will be used in the post-K machine. This machine will officially be operational around 2021. The letter D represents high “density” node and “dynamic” packet slicing for “dual-rail” transfer. Herein we describe the design and the evaluation results of TofuD. Due to the high-density packaging, the optical link ratio of TofuD has decreased to 25% from the 66% optical link ratio of Tofu2. TofuD applies a new technique called dynamic packet slicing to reduce latency and to improve fault resilience. The evaluation results show that the one-way 8-byte Put latency is 0.49 μs. This is 31% lower than the latency of Tofu2. The injection rate per node is 38.1 GB/s which is approximately 83% of the injection rate of Tofu2. The link efficiency is as high as approximately 93%.