1. Engineering SOI Substrates for RF to mmWave Front-Ends.
- Author
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Allibert, F., Andia, L., Morandini, Y., Veytizou, C., Rack, M., Nyssens, L., Raskin, J. P., and Augendre, E.
- Subjects
- *
POROUS silicon , *POLYCRYSTALLINE silicon , *POWER capacitors , *INTERMODULATION distortion , *COMPUTER logic , *COPLANAR waveguides - Abstract
The article discusses that the 5G and Wi-Fi 6(E) are creating new user experiences that require unprecedented network capacity with on-demand data throughput at record low latencies. It mentions that the 5G and Wi-Fi 6(E) are creating new user experiences that require unprecedented network capacity with on-demand data throughput at record low latencies; and reviews the continuous innovation of SOI engineered substrates to address the challenges of today's and future wireless systems.
- Published
- 2020