1. Practical issues in the probing of copper pads
- Author
-
Turner, Timothy
- Subjects
Semiconductor production equipment ,Semiconductor production equipment industry ,Microcomputer industry ,Computer industry ,Cadmium coatings -- Research ,Copper industry -- Research ,Semiconductor production equipment industry -- Research ,Computer industry -- Research ,Computerized instruments -- Research ,Control equipment industry -- Research ,Copper products -- Research ,Semiconductor production equipment -- Research - Abstract
OVERVIEW Copper metallization introduces new challenges for wafer probing. Material effects such as grain size and processing issues such as CMP dishing must be accounted for during probing. Testing techniques […]
- Published
- 2001