1. Improvement of thermal conductivity and dielectric constant of graphene-filled epoxy nanocomposites using colloidal polymerization approach
- Author
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Muhammad Helmi Abdul Kudus, Muhammad Bisyrul Hafi Othman, Hazizan Md Akil, Fatima Javed, and Muhammad Razlan Zakaria
- Subjects
Fabrication ,Nanocomposite ,Materials science ,Polymers and Plastics ,Graphene ,Composite number ,02 engineering and technology ,General Chemistry ,Dielectric ,Epoxy ,010402 general chemistry ,021001 nanoscience & nanotechnology ,Condensed Matter Physics ,01 natural sciences ,0104 chemical sciences ,law.invention ,Thermal conductivity ,law ,visual_art ,Materials Chemistry ,visual_art.visual_art_medium ,Composite material ,0210 nano-technology ,High-κ dielectric - Abstract
The effect of the polymeric cross-link density on the thermal conductivity of an oxidized graphene (OG)-filled epoxy nanocomposite was investigated by two different fabrication methods, namely a conventional OG mixing (OGconventional) and a diamine–colloidized OG (OGcolloidized) method. Epoxy composites with 3 wt% OG were prepared via the diamine–OG fabrication method to produce an epoxy nanocomposite with a higher cross-link density than that of an epoxy composite with also 3 wt% of OG prepared via the conventional fabrication method. The cross-link densities of the epoxy nanocomposites were calculated by means of a solvent swelling test. The epoxy/OGcolloidized nanocomposite showed a higher cross-link density and higher thermal conductivity than the epoxy/OGconventional nanocomposite with the same filler concentration. It was observed that for the epoxy/OGcolloidized nanocomposite, where an amide network was relatively formed between the carboxylic and amine groups, a high cross-link density enhanced the thermal conductivity by means of the transport of phonons. Furthermore, high dispersion of OG gives high dielectric constant to epoxy/OGcolloidized even having the same amount of graphene loading.
- Published
- 2019
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