1. Deformation Modelling of an Embedded Communication Device in a Polymeric Composite Material.
- Author
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Sulic, E., Pell, B. D., John, S., Gupta, R., Rowe, W. S. T., Ghorbani, K., Zhang, K., and Hughes, B.
- Subjects
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DEFORMATIONS (Mechanics) , *MODELING (Sculpture) , *RHEOLOGY , *POLYMERS , *POLYMERIC composites , *COMPOSITE materials , *VISCOELASTIC materials , *THERMOSETTING composites , *HEAT transfer , *VISCOSITY , *ELASTICITY - Abstract
In this paper, an attempt is made to extend the deformation model of a communication device embedded in a viscoelastic thermoset composite polymer such as Sheet Moulding Compound (SMC). The original model takes into account time dependent heat transfer from the mould surface into the SMC charge and the consequent time dependent viscosity propagation during the initial stage of mould closing and subsequent filling. The required model parameters for viscosity and elasticity have been determined from rheological testing. The extended model will examine the effects of a number of process parameters such as mould closing speed, mould temperature and initial charge temperature. The effect of these parameters on the deformation of the communication device is discussed and compared to experimental findings. In addition the signal quality due to antenna deformation as a result of its embedding process is investigated by comparing simulation and experimental results. [ABSTRACT FROM AUTHOR]
- Published
- 2010