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Your search keyword '"Maiz, J."' showing total 2 results
Start Over Author "Maiz, J." Topic cohesive model
2 results on '"Maiz, J."'

1. Adhesion Studies in Low-k Interconnects Using Cross Sectional Nanoindentation.

Author

Molina-Aldareguia, J. M., Ocaña, I., Gonzalez, D., Elizalde, M. R., Sánchez, J. M., Martínez-Esnaola, J. M., Sevillano, J. Gil, Scherban, T., Pantuso, D., Sun, B., Xu, G., Miner, B., He, J., and Maiz, J.

Subjects
INTEGRATED circuits, ROBUST control, THIN films, DIELECTRICS, MOLDED interconnect devices, METAL-metal bonds
Abstract

The thermo-mechanical robustness of interconnect structures is a key reliability concern for integrated circuits. Cross-sectional nanoindentation (CSN) was developed to characterize the interfacial adhesion in blanket films deposited on silicon substrates. Recently, this technique has been adapted to the study of adhesion failure in real interconnect structures. The method has been applied to test chips simulating a portion of the interconnect structure and it has proven useful to study local adhesion effects in patterned structures. The test has been modelled using an FE code and cohesive elements developed in house to improve the understanding of the crack path and its interaction with the different structures present in the interconnect stack. © 2006 American Institute of Physics [ABSTRACT FROM AUTHOR]

Published
2006
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2. Fracture characterization in patterned thin films by cross-sectional nanoindentation

Author

Ocaña, I., Molina-Aldareguia, J.M., Gonzalez, D., Elizalde, M.R., Sánchez, J.M., Martínez-Esnaola, J.M., Gil Sevillano, J., Scherban, T., Pantuso, D., Sun, B., Xu, G., Miner, B., He, J., and Maiz, J.

Subjects
*ION bombardment, *FRACTURE mechanics, *STRENGTH of materials, *STRUCTURAL failures, *FINITE element method
Abstract

Abstract: A testing technique based on cross-sectional nanoindentation has been used to assess the mechanical reliability of interconnect structures. A Berkovich indenter was used to initiate fracture in a silicon substrate and cracks propagated through the structure. To better control crack growth and to convert the problem into two dimensions, a trench parallel to the indentation surface was previously machined using a focused ion beam. The crack lengths obtained for different material systems in the interconnect structure correlate well with the fracture energies measured for the same materials in blanket films. Finite element model simulations incorporating cohesive elements have been used to model the fracture processes and to explain the different cracking behaviour observed. [Copyright &y& Elsevier]

Published
2006
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