1. Thermal transport properties of multiphase sintered metals microstructures. The copper-tungsten system: Experiments and modeling
- Author
-
J. L. Gardarein, Aïmen E. Gheribi, Emmanuel Autissier, M. Richou, Laboratoire Interdisciplinaire Carnot de Bourgogne ( LICB ), Centre National de la Recherche Scientifique ( CNRS ) -Université de Bourgogne ( UB ), Institut universitaire des systèmes thermiques industriels ( IUSTI ), Centre National de la Recherche Scientifique ( CNRS ) -Aix Marseille Université ( AMU ), Physique des interactions ioniques et moléculaires ( PIIM ), Aix Marseille Université ( AMU ) -Centre National de la Recherche Scientifique ( CNRS ), Laboratoire Interdisciplinaire Carnot de Bourgogne (LICB), Université de Bourgogne (UB)-Centre National de la Recherche Scientifique (CNRS), Institut universitaire des systèmes thermiques industriels (IUSTI), Aix Marseille Université (AMU)-Centre National de la Recherche Scientifique (CNRS), Physique des interactions ioniques et moléculaires (PIIM), Centre National de la Recherche Scientifique (CNRS)-Aix Marseille Université (AMU), and Laboratoire Interdisciplinaire Carnot de Bourgogne (ICB)
- Subjects
010302 applied physics ,[PHYS]Physics [physics] ,Materials science ,[ PHYS ] Physics [physics] ,Metallurgy ,General Physics and Astronomy ,chemistry.chemical_element ,Spark plasma sintering ,Sintering ,02 engineering and technology ,Tungsten ,021001 nanoscience & nanotechnology ,Microstructure ,Thermal diffusivity ,01 natural sciences ,Grain size ,chemistry ,0103 physical sciences ,Grain boundary ,0210 nano-technology ,Copper–tungsten - Abstract
International audience; The thermal diffusivity of Cu-W sintered alloys microstructures is measured at room temperature at different compositions, using rear face flash experiments. The samples are synthesized with the Spark Plasma Sintering technique. The resulting microstructures are slightly porous and consist of angular nanoscale grains of tungsten with medium sphericity in a copper matrix. The tungsten particles are at the nanoscale with an average grain size of 250 nm in contrast to the copper matrix for which the average grain size lies in the range 20 mu m-30 mu m; this is large enough to avoid the grains boundary effect upon the thermal transport. The overall porosity of the microstructures lies within the range: 6%
- Published
- 2016