1. Phase equilibria studies of Sn-Ag-Cu eutectic solder using differential cooling of Sn-3.8Ag-0.7Cu alloys
- Author
-
Ted Carper, Jae-Yong Park, Choong-Un Kim, and Viswanadham Puligandla
- Subjects
Chemistry ,Alloy ,Mineralogy ,Thermodynamics ,engineering.material ,Condensed Matter Physics ,Microstructure ,Electronic, Optical and Magnetic Materials ,Differential scanning calorimetry ,Soldering ,Phase (matter) ,Materials Chemistry ,engineering ,Eutectic bonding ,Electrical and Electronic Engineering ,Phase diagram ,Eutectic system - Abstract
This paper is a study of the phase equilibria of the Sn-3.8Ag-0.7Cu alloy investigated by a differential cooling method. The difficulty in assessing phase equilibria of the Sn-Ag-Cu (SAC) system because of the insufficient resolution of conventional characterization techniques is solved by inducing preferential growth of a solid phase in a melt by holding the alloy at the solid-liquid phase-equilibrium field. Application of the technique to Sn-3.8Ag-0.7Cu with varying holding temperatures yielded results that the alloy is slightly off eutectic composition. The phase-formation sequence of the alloy during solidification was found to be Ag3Sn, β-Sn, and finally the ternary eutectic microstructure.
- Published
- 2003
- Full Text
- View/download PDF