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Background Transplant recipients are supposedly in a more anemic, catabolic, and even inflammatory state at re-entering hemodialysis due to chronic rejection. The goal of this study was to clarify how transplant recipients can re-enter dialysis safely by focusing on control of anemia. Methods From 2012 to 2014, a total of 29 transplant recipients re-entered hemodialysis because of chronic rejection (ie, the chronic kidney disease with transplant [CKDT] group). At the same time, in 2014, a total of 30 patients with chronic kidney disease without transplantation entered dialysis as the control group (ie, the CKD group). CKDT recipients (mean ± standard deviation age, 41.9 ± 11.8 years; 18 male subjects, 10 female subjects; frequency of diabetes, 10%; duration of graft survival, 12.5 ± 4.3 years) were younger and fewer had diabetes compared with the CKD group (age, 53.2 ± 10.5 years; 21 male subjects, 9 female subjects; frequency of diabetes, 36%). Patient characteristics at entering dialysis in both groups were analyzed according to retrospective chart review. Results At entering dialysis, there were no significant differences between the CKD and CKDT groups in terms of the following: dose of darbepoetin; concentrations of hemoglobin, albumin, and C-reactive protein; cardiothoracic ratio; blood urea nitrogen and creatinine levels; estimated glomerular filtration rate; initial ultrafiltration; and duration of hospitalization for initiation of dialysis. The only difference between groups was mean weight at entry to dialysis (CKDT group, 58.5 ± 15.1 kg; CKD group, 67.1 ± 14.8 kg; P = .03). The darbepoetin dose per kilogram of weight did not differ between groups (CKDT, 2.28 ± 2.03 μg/kg; CKD, 2.12 ± 1.6 μg/kg; P = .95) in the final month before entry to dialysis. Conclusions Safe re-initiation of dialysis is important for recipient survival. Although anemia is supposedly higher in transplant recipients due to immunosuppression, this single-center analysis found no difference in anemia in CKD with or without transplantation, caused by good use of erythropoietin-stimulating agents in both groups.

This paper will examine the combined use of both permanent and temporary high-temperature polyimide adhesives used to avoid thin wafer handling. While 3D-TSV technology can improve functionality and performance, adoption of this technology has been delayed by cracking as well as unwanted wafer bowing. This presentation shows means by which a photo-lithographic polyimide adhesive is used in a temporary bonding scheme to eliminate intermediate-stage thinned wafer handling.

Background and study aims The study aimed to assess a newly developed endoscopic marker designed to cause only minor inflammatory reactions. Materials and methods Chitosan and carbon powder were used in the marker substance. The product was a viscoelastic solution, which was injected into the submucosa in rat stomach walls. The tissue reactions were then examined histopathologically. The structure of the injected marker substance was examined with electron microscopy into rat stomach walls. India ink, which is currently used as an endoscopic marker, served as the control. Results Histopathological examination showed that inflammatory reactions with the novel agent were remarkably mild in the rat organs, while submucosally applied india ink caused severe inflammation in situ. The electron-microscopic findings showed that the carbon particles used were completely spherical in shape and that the carbon in the marker substance was entrapped in the chitosan networks. The india ink was shown to consist of a mixture of fine carbon particles and adhesive additives. Conclusions The chitosan-carbon solution appears to be a promising endoscopic marker substance, causing significantly reduced inflammation.

To improve the electrochemical properties of the silicon film anode in lithium cells, we prepared three types of silicon based-films, i.e., intrinsic silicon, n-type silicon, and Ag10Si90 binary fi...

For lithium-ion batteries of C/(spinel Li-Mn-O), severe capacity loss occurs after storage of the battery at >50°C. According to our previous studies, this occurrence is predominantly attributable to degradation of the carbon anode, which was induced by electroreduction of Mn(II) dissolved from the spinel; this step is followed by the irreversible electrochemical reaction at the graphite/(Mn deposits)/electrolyte interface. 2-Vinylpyridine (VP) used as an additive in the electrolyte suppressed this degradation; therefore, improving the battery performances. During the first "charge," the electrochemical reductive polymerization of VP monomers at about 0.9 V vs. Li/Li + resulted in the film formation of poly(2-vinylpyridine) on the graphite surface. The quantity of charge passed for the polymeric film formation depends on the amount of VP addition. Surface analyses using X-ray photoelectron spectroscopy and electron microscopy confirmed that the electrodeposited film blocked the electroreduction of dissolved Mn(II) on the graphite electrode.

Electrochemical performance of a graphite electrode for lithium-ion batteries was successfully and easily improved by sodium ion dissolved in an electrolyte solution. Sodium ion was added by dissolving 0.22 mol dm−3 NaClO4 into a 1 mol dm−3 LiClO4 ethylene carbonate–diethyl carbonate (1:1 by volume) electrolyte solution prior to charge–discharge cycle. By sodium-ion addition, an irreversible capacity at the initial cycle was obviously reduced, and reversible discharge capacities increased with better capacity retention. From ac impedance measurements, a graphite electrode in the sodium ion added electrolyte had much smaller interface resistance compared to that obtained in sodium ion free one. Furthermore, the electrode surface morphology observed by electron microscopes after charge–discharge tests got more uniform in the sodium added electrolyte. Keywords: Graphite, Lithium-ion battery, Lithium intercalation, Sodium additive, SEI

In order to clarify the end-functionalization effect of polymers modified by iminium ion, a model compound with a modified chain end was prepared by directly reactingn-butyllithium withN-methyl-2-pyrrolidone and then quenching by the addition of methanol. It is shown that the model compound includes the iminium ion group and that the adsorption bands in the IR-spectra of the chemically modified polymer were similar to those of model compound

Electrochemical performance of a graphite electrode for lithium ion batteries are easily improved by sodium ion dissolved in an electrolyte solution as reported recently by our group. On the contrary, when potassium ions were added by dissolving 0.2 mol dm−3 KPF6 into a 1 mol dm−3 LiPF6 ethylene carbonate–diethyl carbonate (1:1, v/v) electrolyte solution prior to charge–discharge cycle, an electrochemical performance of a graphite electrode was deteriorated compared to that tested in an additive free electrolyte; larger irreversible capacity at the first cycle and worse retention of discharge capacities on successive cyclings. During the first charge in a potassium additive system, ex situ XRD observation of graphite electrodes revealed that lithium intercalation hardly proceeded in the lower potential region less than 0.1 V versus Li though lithium ions were intercalated at >0.1 V. Electroreduction of potassium ions on the electrode occurred instead of lithium intercalation into graphite in the lower potential region. Furthermore, the electrode surface morphology observed by electron microscopes after charge–discharge tests got less uniform in the potassium added electrolyte.

A high density multilayer wiring board was developed, using thin film laminating technology. The fundamental features of the fabrication process are laminating the high heat resistant polymer film with an adhesive layer, forming via holes by plasma etching and filling them up by electroless copper metallization. The heat resistant adhesive layer consists of polyimide as the matrix and bismaleimide as the melting constituent. Heat resistance of more than 10 min. at 330/spl deg/C can be achieved. The via holes of /spl phi/=25 /spl mu/m are formed by a conformal mask method using plasma etching. This paper describes the fundamental technologies for the fabrication process particularly focusing on electroless copper plating.

A thin film laminated high density multilayer wiring board was developed using electroless copper plating technology. The basic steps in the fabrication process are: laminating the high heat resistant polymer film, forming via holes by plasma etching and filling them by electroless copper metallization. The 25 μm diameter via holes can be completely filled with copper using the selective electroless plating method. This paper describes the fabrication process, focusing particularly on electroless copper plating.

Aims: To demonstrate the usefulness of polymerase chain reaction (PCR) methodology with both the FR2A/LJH/VLJH and the FR1c/LJH/VLJH primer sets for detecting monoclonal immunoglobulin heavy chain (IgH) gene rearrangement in B cell non-Hodgkin lymphomas (B-NHLs). Methods: Eighty three patients with B-NHL were enrolled in this study. DNA was isolated from paraffin wax embedded sections and amplified by PCR to determine the sequences of the rearranged IgH gene. Each PCR product was subcloned. Cycle sequences and sequence analyses were done to determine the clone specific IgH variable region (VH) sequences. Results: Clonal IgH gene rearrangements were detected in 45 cases with FR2a/JH/VLJH and in 14 of the remaining cases with FR1c/JH/VLJH. Most of the cases detectable with FR2a/JH/VLJH were derived from VH3 and VH4 families. Five of six cases in the VH1 family and one in the VH7 family were amplified with the FR1c/JH/VLJH primer set only. Conclusion: The detection rate of IgH rearrangement in B-NHLs can be increased by using both FR2A/LJH/VLJH and FR1c/LJH/VLJH, and these two primer sets are suitable for routine PCR methodology. Moreover, each primer set appears to be closely related to VH family specificity.

For lithium-ion batteries of C/(spinel Li–Mn–O), the sever capacity loss occurs after storage of the battery at >50 °C. This is mainly due to degradation of the carbon which was induced by electroreduction of Mn(II) dissolved from the spinel; this step is followed by the irreversible electrochemical reaction at the graphite/(Mn deposits)/electrolyte interface. However, 2-vinylpyridine as an additive into the electrolyte was capable of suppressing this degradation of graphite anode, therefore, improved the battery performances. During the first charge, electropolymerization of 2-vinylpyridine from about 0.9 V vs Li/Li+ resulted in film formation of poly(2-vinylpyridine) on the anode surface. The polymer protected the graphite from dissolved Mn(II).

Electrochemical reduction and oxidation of a graphite electrode were carried out in nonaqueous electrolytes that consisted of ethylene carbonate/diethyl carbonate (1:1) solvents where LiClO 4 and NaClO 4 were codissolved. Reversible lithium intercalation into graphite occurred accompanied with no remarkable side reactions in the potential range between 1.5 and 0.02 V vs Li/( 1mol dm -3 Li + ), that is, no sodium deposition and no sodium intercalation were observed. Comparing to results in a sodium-free electrolyte, i.e., a conventional electrolyte in Li-ion batteries, the initial irreversibility was noticeably suppressed by codissolving sodium ions, and kinetics of the lithium intercalation were enhanced with better capacity retention during cycling. Additionally, the redox behavior of graphite for lithium-ion batteries was improved by sodium ion coexistence, with no inferior influences on the negative and LiMn 2 O 4 positive electrodes and electrolyte. When the sodium ion concentration increased to 0.22 mol dm -3 , the superior reversibility of lithium intercalation was observed in comparison with that in a sodium-free system; however, the higher concentration of sodium ions deteriorated the lithium intercalation properties. We found that a surface layer formed on graphite electrode got less resistive as a lithium-ion conductor by entrapping sodium during the initial electroreduction with optimal Na + concentration.

The metal capping barrier deposited by the electroless cobalt tungsten boron (CoWB) alloy plating method for ultralarge scale integration applications was investigated. The CoWB film was formed directly on copper without a palladium catalyst, using dimethyl amin borane (DMAB) as a reducing agent, and it was deposited selectively on 0.25 μm wide copper interconnects separated with 0.25 μm spacing The CoWB thin films were effective barriers against copper diffusion even at CoWB thicknesses as low as 50 nm. Compared with the CoWB film, cobalt tungsten phosphorus films deposited directly on copper using DMAB as a deposition initiator was not effective as a copper diffusion barrier. The plating films contained mainly cobalt with a significant amount of tungsten (up to 20 atom %) and a small amount of boron. Additionally, we propose a newly developed alkaline metal free electroless CoWB plating solution using tetramethyl ammonium hydroxide as a pH adjuster. © 2005 The Electrochemical Society. All rights reserved.